In recent years, low-voltage MOSFETs for automotive applications have shown a trend toward smaller packages, such as the 5060 size and even more compact options. However, this miniaturization presents significant challenges in achieving reliable assembly, primarily due to the reduced terminal spacing and pinless designs.
To address these issues, the new HPLF5060 package occupies less space than the widely used TO-252 package (6.6 mm × 10.0 mm), while improving board mounting reliability through the adoption of gull-wing pins. Furthermore, the use of copper clip bonding technology enables high-current operation, making the HPLF5060 an ideal solution for demanding automotive environments.
Mass production of new products using this encapsulation began in November 2025. Online sales have already started, and the product is also available for sale through online distributors such as DigiKey and Farnell.
In addition to expanding the range of products using this package, mass production of the smaller DFN3333 (3.3 mm × 3.3 mm) package, which employs wettable flank technology, is scheduled to begin around February 2026. Furthermore, development has begun on a TOLG (TO-Leaded with Gull-wing) (9.9 mm × 11.7 mm) package to further expand the range of high-power, high-reliability packages.
Application examples:
Main control circuits for inverters, electric pumps, LED headlights, etc.
EcoMOS™
is ROHM's brand of silicon power MOSFETs designed for energy-efficient power device applications. Widely used in applications such as household appliances, industrial equipment, and automotive systems, EcoMOS™ offers a diverse range that allows product selection based on key parameters such as acoustic performance and switching characteristics to meet specific requirements. EcoMOS
™ is a trademark or registered trademark of ROHM Co., Ltd.
