Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional fine-pitch technology node capacity to serve mission-critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL™) applications. These joint efforts strengthen ADI’s resilient hybrid manufacturing network, which helps isolate external factors while supporting the means to increase production and scale rapidly to meet customer needs.
"Our hybrid manufacturing network helps deliver a competitive advantage to our customers. Together with TSMC, we can serve our customers with more resilient supplies, respond even more quickly to customer needs and changing market conditions, and focus our investments on innovative manufacturing solutions that benefit society and the planet," said Vivek Jain, Executive Vice President of Global Operations and Technology at ADI.
"Today's announcement demonstrates TSMC's commitment to helping our customers meet their long-term capacity needs," said Sajiv Dalal, Executive Vice President of Business Development for TSMC North America. "We are delighted to expand our existing collaboration with ADI, which will help ensure a strong and dynamic semiconductor innovation journey with robust manufacturing capabilities."
