Through capacity and quality improvements implemented during a recent facility change at the company's Washington Works plant in Parkersburg, West Virginia, the company achieved an immediate 15% capacity increase for its Teflon™ PFA polymer and expects to achieve a total capacity increase of 25% by the end of this year. The growing demand for this high-performance polymer to meet global trends such as 5G will require even more capacity, and the company is making an additional investment in its Washington Works facility to double its current production capacity by 2021.
"For 80 years, the fluoropolymers business at Chemours has provided industry-defining solutions to meet our customers' most complex and evolving needs," said Jesal Chopra, vice president of fluoropolymers at Chemours. "This capacity expansion is a testament to our ongoing commitment to supporting our customers' growing needs," he added.
The high-performance polymer PFA Teflon™ provides reliable, high-quality solutions, enabling device manufacturers to maximize chip yields and design freedoms while minimizing downtime and process variability.
Every day, smart devices are connecting our world in ways never before imagined. As our reliance on these devices grows, so does the demand for high-performance, low-cost semiconductor technologies.
By 2020, the Internet of Things is projected to consist of more than 50 billion connected devices. This impending technological revolution is driving demand for increasingly powerful and efficient integrated circuits that will push the known limits of design scale and complexity. To meet the ever-tightening requirements for higher chip densities and greater yields, integrated device manufacturers (IDMs) will rely on manufacturing system reliability and low failure rates like never before.
From bulk chemical distribution to wet etching and CMP processes, chemically inert Teflon™ fluoropolymers enable equipment and systems to use high-performance, contamination-free chemicals and gases during the IC manufacturing process.
