“Our new technology collaboration with Qualcomm Technologies enables developers to achieve the same level of extreme computing performance and interface bandwidth with an energy-efficient design that was only possible with x86 architectures for decades,” said Konrad Garhammer, CTO and COO of congatec. “For the first time, developers can build high-end embedded applications that leverage extraordinary energy efficiency and performance per watt for the most demanding embedded hardware, in a form factor that is nearly the size of a credit card.”.
“Our collaboration with congatec combines the best-in-class computing performance, industry-leading energy efficiency, on-device AI, and industrial-grade features of the Dragonwing IQ-X series with the flexibility, scalability, and robustness of congatec’s COM-HPC Mini portfolio and application-ready ecosystem,” said Enrico Salvatori, senior vice president and president of Qualcomm Europe, Inc. “Together, we are driving the transformation of smart industries by delivering superior platforms that enable customers to build next-generation industrial PCs and deploy cutting-edge AI applications at scale.”.
