This is a tangible result of the research activity driven by industrial doctoral students and students in a pre-competitive environment, oriented towards the generation of knowledge, the evaluation of technologies and the validation of technological concepts.
This progress reinforces both entities' commitment to developing strategic technological capabilities, fostering specialized talent, and strengthening public-private collaboration in a key area for European technological autonomy.
The designs submitted for manufacturing include three integrated circuits using 65-nanometer silicon technology, sent to TSMC, currently the world's leading foundry, for evaluation against a widely used industry standard, along with a photonic integrated circuit (PIC) developed within the framework of the collaboration. Together, these projects allow for the exploration of different technological approaches and strengthen analysis, design, and integration capabilities, with potential benefits for the Indra Group.
Four chip designs manufactured and under evaluation.
The chair established by UPM and Indra Group has consolidated a joint innovation model that has enabled the design and shipment for manufacturing of four integrated circuits: three using 65-nanometer silicon technology and a fourth, a photonic type, developed using indium phosphide technology. The chips have already been manufactured and received, and are currently in the evaluation and characterization phase.
The silicon designs include a circuit based on RISC-V architectures and two circuits geared towards 3D heterointegration testing, with the aim of moving towards more compact radio frequency modules. These are complemented by a photonic integrated circuit, designed to explore beamforming architectures in electronically scanned antenna systems. Together, the four designs share a common purpose: to evaluate technologies that contribute to greater integration of advanced radio frequency modules, a path that will require further validation and collaboration with the specialized ecosystem to assess its potential future transferability.
The Chair's activities have been complemented by the preparation of Bachelor's and Master's theses in areas of interest to the Indra Group, as well as advanced technological studies and training and skills development activities. Participating students have also been able to visit the advanced Research & Technology (R&T) laboratories at the Indra Group's Technological Innovation Center, learn about equipment and capabilities related to radio frequency, GaN technologies, photonics, and advanced packaging, and explore opportunities for professional integration within the company.
This set of advances reinforces the role of the Chair as an active instrument of collaboration between university and industry in microelectronics, and places it among the most active academic-industrial initiatives in Spain in this field. The initiative contributes to accelerating the generation of specialized talent, the evaluation of technologies, and the development of capabilities, strengthening the position of UPM and Indra Group within the European ecosystem.
Boost to chip production and the semiconductor ecosystem
These advances in chip design and evaluation reinforce Indra Group's position as a leading company in the microelectronics and semiconductor ecosystem, a technology that is increasingly in demand and critical to guaranteeing technological sovereignty and strategic autonomy for Europe.
Indra Group is the majority shareholder of SPARC Foundry, a company specializing in the production of III-V semiconductors, with a particular focus on photonics. Its factory is scheduled to begin operations in Vigo in 2027. This stake is part of a broader strategy to develop its own capabilities and strengthen collaboration with technological, academic, and industrial partners within the ecosystem.
The SPARC project is unique in Spain and one of the most ambitious European chip production initiatives. This public-private partnership helps position Spain among the countries with advanced technological and production capabilities in this field, and complements other collaborative efforts aimed at evaluating, developing, and integrating semiconductor technologies of strategic interest.
