The modules integrate Qualcomm Dragonwing™ processors from Qualcomm Technologies, Inc. and are part of NEURA’s broader distributed computing architecture. The collaboration brings together three complementary capabilities: NEURA’s physical AI and robotics architecture, which leverages Qualcomm Technologies’ advanced edge computing platforms, and SECO’s expertise in embedded engineering and industrial manufacturing.
NEURA believes that physical AI will be characterized by three fundamental technology layers: sensors, computing, and cloud infrastructure. Inside the machine, NEURA follows a “brain + nervous system” architecture. Through its “smart limbs” concept, sensors and computing are distributed throughout the robot, bringing intelligence to the joints, sensors, and physical interactions where real-time decisions are required. This real-time responsiveness at the edge is what allows robots to work safely and reliably alongside people. Qualcomm Technologies' Dragonwing Robotics processors contribute to the on-device AI performance, energy efficiency, and low-latency control required by this decentralized approach.
SECO handles the engineering and industrialization of the corresponding compute modules for scalable production. In this way, each partner contributes its strengths to a broader physical AI architecture.
With SECO, NEURA gains a strong European partner for its physical AI ecosystem. As a European leader in edge AI, with extensive experience in embedded computing and electronics, SECO designs the compute modules that integrate Dragonwing processors into NEURA's cognitive robots, enabling the hardware to be reliably manufactured in the volumes required for NEURA's expansion.
Beyond this initial commitment, NEURA and SECO are working on the next steps in their collaboration. These include a “NEURA Gym” in Italy, which will be NEURA’s first training center in Southern Europe, and the joint collection of real-world production data as NEURA robots are deployed in industrial environments.
SECO is already a strong partner in the Qualcomm Technologies ecosystem and has been developing various levels of computing platforms for industrial applications based on Dragonwing processors. The design and development of computing modules for NEURA’s cognitive robots brings together all these key technologies.
The collaboration extends beyond the computing modules integrated into NEURA robots. A particular focus is on semiconductor and electronics manufacturing, where NEURA and SECO will use real-world production data to develop new physical AI-based automation solutions for industry. The goal is to teach intelligent machines increasingly complex production processes, translate this knowledge into scalable automation capabilities, and ultimately enable these technologies to be deployed in semiconductor manufacturing environments worldwide. This creates a powerful cycle: European industrial processes generate real-world knowledge, physical AI learns from it, and the resulting capabilities can then be scaled globally.
For NEURA, this reflects an important principle underlying the “Neuraverse”: industrial knowledge should not be trapped in individual automation projects. Skills developed from real-world applications can become reusable components for a new generation of intelligent machines.
Europe already has many of the ingredients needed to lead in physical AI: robotics, industrial manufacturing, embedded systems, sensors, automation, and world-class research. The opportunity lies in connecting them. The computing hardware that SECO manufactures for NEURA’s robots will be developed and produced in Europe, adding another link to a resilient European supply chain for physical AI. The collaboration between NEURA and SECO combines European engineering and industrialization with world-leading computing technology, creating another link in a scalable physical AI ecosystem. The goal is technological sovereignty through collaboration: developing critical capabilities and industrial technical knowledge in Europe, while connecting with the best technologies in the world.
David Reger, founder and CEO of NEURA Robotics: “Physical AI won’t be built by a single company. It requires an ecosystem encompassing sensing, computing, cloud, and industrialization. Through our collaboration with Qualcomm Technologies, we are advancing the computing power that underpins our Brain + Nervous System and Smart Limb architecture, and SECO brings additional European engineering and manufacturing expertise to help us scale it. Together, we will use real-world industrial processes to generate data and develop physical AI solutions for semiconductor manufacturing that can ultimately be deployed anywhere in the world. This is exactly how I believe Europe should approach physical AI: by combining our industrial knowledge, building together, and scaling globally.”
Max Mauri, CEO of SECO: “We are proud to collaborate with NEURA on both the industrialization of their cognitive robotics platforms and the application of physical AI to our own industrial environment. By combining our strong engineering and technology expertise with NEURA’s physical AI architecture and Qualcomm Technologies’ advanced computing platforms, we can create solutions whose relevance extends far beyond a single factory or application.”
Nakul Duggal, executive vice president and general manager of the Automotive, Industrial & Embedded IoT, and Robotics group at Qualcomm Technologies, Inc.: “As physical AI moves from innovation to real-world deployment, intelligent and scalable computing platforms are essential to enabling the next generation of cognitive robotics. Our collaboration with NEURA Robotics combines Dragonwing’s high-performance, low-power AI processing with NEURA’s pioneering Brain + Nervous System architecture, helping to bring more responsive, capable, and adaptable robots to industrial and commercial environments. We are pleased that SECO is joining this expanding ecosystem and helping to accelerate the path to reliable, large-scale production.”
