Frédérique Le Grevès, Executive Vice President of Public Affairs for Europe at STMicroelectronics and President of ST France, who also serves as Vice President of ESIA, stated: “Europe has the technology, talent, and ambition to lead key segments of the semiconductor industry in Europe, but we must act more quickly. The review of the EU Chip Act presents an excellent opportunity for the EU to develop an industrial strategy vision and implement it in a way that strengthens the European semiconductor ecosystem. Europe’s strengths—in sensors, microcontrollers, power semiconductors, and cutting-edge artificial intelligence—are a perfect fit for the needs of key end markets, such as AI infrastructure and applications, automotive, industrial automation, robotics, connectivity, energy infrastructure, aerospace, and defense.” If a second EU Chip Law helps us to build on these strengths, we will be better positioned to lead in the key technologies that underpin the next wave of global growth.
During the event, policymakers, industry leaders, and stakeholders engaged in a forward-looking dialogue on how to strengthen the semiconductor ecosystem in Europe. The event featured opening speeches by MEP Matthias Ecke (Socialists and Democrats, Germany) and Dr. Andreas Schumacher, Executive Vice President and Head of Strategy and Mergers & Acquisitions at Infineon Technologies.
Subsequent roundtables explored how the European semiconductor policy framework should evolve to address the challenges of global competition, technological sovereignty, and supply chain resilience. Ms. Le Grevès presented the manufacturing sector's perspective, while Sébastien Dauvé, CEO of CEA-Leti, and Pierre Millette, Chief Technology Officer of the European Automobile Manufacturers' Association (ACEA), shared the views of upstream and downstream stakeholders. Dr. Tim Schulze, Senior Policy Officer at the German Federal Ministry for Economic Affairs and Energy, also contributed the perspectives of policymakers from the EU's most populous member state. Discussions focused on the need for a more agile, innovation-driven approach that supports both industrial growth and strategic autonomy.
The event concluded with closing remarks from Pierre Chastanet, head of the European Commission's Microelectronics and Photonics Unit, who reaffirmed the Commission's commitment to working closely with stakeholders to shape the next phase of semiconductor policy. At a time when Europe is reviewing its Chip Act, the ESIA event provided a timely exchange to align the ambitions of the public and private sectors, ensuring that the continent remains competitive and resilient in a rapidly evolving global landscape.
