ROHM announces the availability of 1608 size 2-color LED chips. In addition to its revolutionary dimensions, the SML-D22MUW features a more reliable design and a rear-facing electrode configuration suitable for high-resolution displays.LED chips have been used for several years in digital displays for industrial equipment and consumer devices. Conventional digital displays use a single color to indicate numbers, but there is a growing need to change the color to facilitate the recognition of anomalies. However, this generally requires either using two separate LEDs, which doubles the mounting surface area and development costs, or opting for a standard two-color LED, which also increases the board size.
In contrast, the technologies and processes developed by ROHM have made it possible to integrate two chips into a package the same size as conventional single-color LEDs, thus enabling the emission of multiple colors in a smaller space. The space occupied on the board has been reduced by 35% compared to standard 1.5 x 1.3 mm dual-color LEDs, which helps to achieve thinner displays. Furthermore, after considering the operating conditions during reflow, measures were adopted to prevent solder penetration into the resin package, ensuring significantly greater reliability.
Main features
1. The smallest size in its class helps achieve smaller and thinner devices.
In addition to miniaturizing the element, the SML-D22MUW leverages PICOLED™ mounting and wire bonding technologies to assemble two chips (red and green) in a compact 1.6 x 0.8 mm package, the same size as conventional single-color LEDs.
The extremely dense configuration of the color elements also results in excellent color mixing properties, enabling the production of not only red and green but also other intermediate colors.
2. Measures to prevent solder penetration ensure superior reliability.
The addition of a protective layer before the gold plating process blocks the solder from penetrating the resin and is characterized by good wettability. This prevents the solder from penetrating the resin, eliminating failures due to short circuits and helping to increase reliability.
3. Electrode configuration on the back face for high-resolution displays
Adopting an electrode design on the back face allows mounting in tight spaces, and therefore incorporating high-definition displays into dot matrices and other applications.
Terminology
PICOLEDTM: ROHM's ultra-compact LEDs ideal for portable equipment such as wearable and mobile devices.
Wire Bonding: The process of mounting a chip directly onto a substrate and connecting gold, aluminum, or copper wires.
