With a total package height of only approximately 2.00 mm, Molex PSI offers a slim design for space-constrained applications while minimizing substrate costs. Utilizing the Pico-EZmate™ harness system, the solution integrates electrical and mechanical features into the die with a simple, solderless connection.
The PSI system is ideal for high-density, high-power applications such as downlighting (pendant and linear lighting, track lighting) and area lighting (roads, garages, and exterior wall LED lighting). The integrated chip-on-a-chip (CoB) LED technology ensures excellent future-proofing capabilities, allowing for the integration of additional components. The system supports various CoB designs, including:
• Circular with a CoB size of 22.50 mm x 22.50 mm, an outer diameter of 36.00 mm, and a profile height of 2.0 mm
• Rectangular with a CoB size of 22.50 mm x 22.50 mm, outer dimensions of 36.50 mm x 28.50 mm, and a profile height of 2.0 mm
• Customizable shapes and connections
The Pico-EZmate harness system securely attaches the LED array bracket without soldering, special processes, or tools, establishing an efficient connection that minimizes contact with the array to reduce the risk of damage. The vertical quick-coupling connection, positive locking mechanism, and gold-plated contacts provide excellent reliability. The harnesses will be offered in three different wire gauges and various lengths to enable multiple initial harness options to suit application requirements.
