Unlike conventional TOLL (TO-Leadless) packages, which dissipate heat through the bottom, the TOLT package is designed to release heat directly from the top via a mounted metal heat sink. This innovative structure reduces thermal resistance between the junction and the external environment, making it well-suited for applications with high thermal demands, such as scooters and light electric vehicles (LEVs).
Simulations and tests conducted by Magnachip demonstrated that our new 80 V MV TOLT package solution achieved an average 22% reduction in junction temperature compared to standard TOLT packages. This improvement not only extends application life but also enhances system reliability. Furthermore, the TOLT package enables compact and lightweight application designs thanks to its high power density and efficient thermal flow, without compromising current handling capacity or thermal safety margins.
