Applications such as in-vehicle camera video links, automotive multigigabit Ethernet networks, and infotainment interfaces like USBx, HDMIx, and PCIex can be protected against potentially damaging ESD events.
The flip-chip packages have minimal parasitic components: they have no bonding wires or copper frames, resulting in high performance and excellent signal integrity. Nexperia's new 2- and 3-pin FC-LGA diodes feature ultra-low capacitance.
In addition to offering best-in-class signal integrity, this diode family also boasts the industry's widest range of reverse operating voltages (Vrwm), including 5V, 18V, 24V, and 30V options. The higher voltage devices offer the added advantage of flexible board placement to protect multiple connected devices at various points along a link. With products such as the PESD5V0H1BLG-Q in the DFN1006LD-2 package and the PESD5V0H2BFG-Q in the DFN1006LD-3 package , Nexperia is the only supplier to offer ESD protection diodes in flip-chip packages with SWF (Side Wettable Flanks). This enables the use of automated optical inspection (AOI) of solder joints to ensure they meet the industry's demanding quality requirements. Automotive, where safety is paramount.
“These new diodes combine SWF with an optimized DFN1006 footprint for maximum signal integrity and represent a significant improvement over currently available options. Designed to support the growing trend of data-intensive automotive applications, they reflect Nexperia’s proven expertise in package technology. This launch reinforces our commitment to delivering innovative solutions that meet the evolving demands of engineers across a wide range of industries,” says Alexander Benedix, Head of the Protection and Filtering Product Group at Nexperia.
The first three 5V Flip-Chip diodes are in mass production. Six products with 18V, 24V, and 30V are in the sampling phase and will be available for mass production in the second quarter of 2025.

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