Molex is one of the first manufacturers to incorporate DuPont™ Pyralux® TK flexible circuit board material into the mass production of multilayer flexible circuit board systems. Pyralux® TK is a bonded foil system with a flexible copper coating on both sides, featuring a DuPont™ Teflon® fluoropolymer layer and a DuPont™ Kapton® polyimide layer. This results in excellent electrical performance in high-frequency and high-speed digital flexible circuit applications.
The dielectric constant and low loss characteristics of Pyralux® TK allow for mechanically flexible construction with tighter bend radii and faster transmissions compared to standard flexible systems.
Molex's high-speed, low-loss flexible circuit assemblies are available with either automatic winding or mechanically assisted winding and offer options for flexible three-dimensional encapsulation, while minimizing insertion losses and improving airflow compared to a standard printed circuit board design.
