Current LED array carriers represent an intermediate solution between the challenge of developing metal printed circuit boards or ceramic substrates for LED arrays that are small enough to minimize costs and meet optical performance requirements, while also incorporating the necessary electrical, mechanical, and optical characteristics to simplify their use in lighting systems. Molex's new technology leverages the connectivity and ease of use of metal or ceramic substrates by incorporating them into a separate plastic substrate, thus improving thermal, optical, and mechanical interconnect functionality. This plastic substrate can be combined in various ways with an LED array package to provide the array with a superior surface offering multiple connection options.
This new technology, developed in cooperation with Bridgelux, Inc., has been incorporated into Bridgelux's newly launched Vero* family of arrays. It is anticipated that this interconnect technology will make LED array products easier to integrate and more cost-effective, enabling original equipment manufacturers (OEMs) to reduce system costs, shorten lead times, and improve the reliability of their lighting designs. These advanced products feature thermally insulated solder pads, an integrated Molex Pico-EZmate™ header, and enhanced mechanical clamping and optical reference characteristics, all while maintaining a very low profile. The pads are designed for easier and more robust direct soldering compared to soldering onto aluminum or ceramic array packages. The Pico-EZmate header provides a solderless electrical interface, allowing for on-site repair and replacement.
The interconnect technology, housed in a plastic casing, is based on Molex technology already used in consumer electronics and other high-volume markets. The Molex Pico-EZmate range will include numerous UL-certified mating products to provide a robust interconnect system that can be easily and cost-effectively implemented in any product within the Vero family.
