Compared to standard interposers, these interposers offer higher density, XYZ axis flexibility, customizable shapes and patterns, extended lifecycle, low normal force with high deflection, and 28+ Gbps throughput.
 
These 0.80 mm pitch arrays (ZA8 Series) are available with the option of single or double compression contacts with solder balls. With up to 400 micro-formed BeCu contacts, they feature a low force of 25 g with 0.20 mm contact deflection. Z-Ray™ is a one-piece design mounted on a durable, low-profile FR4 substrate layer under high pressure and temperature to achieve a stackable height of 1.00 mm. Threading and alignment holes are standard for use with press-fit hardware for a secure, non-over-compression connection between PCBs. A 0.80 mm pitch 34 AWG twinax cable, with standard 8 and 16 pairs, is under development.
 
Several options are available, including the standard interposer shape, multiple pitches as low as 0.65 mm, a higher density of up to 1,200 contacts per square inch in any pattern, and stackability in heights from 0.50 mm to 4 mm. The interposer construction is adaptable with multi-layer FR4, for example, pitch expanders and other integrated interconnect circuitry. Design flexibility also includes features such as latches, thermal expanders, and quick-release force springs for more demanding applications.

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