The new capsule dimensions are 10 mm x 10 mm, 15 mm x 10 mm and 30 mm x 10 mm, all with a profile height of 3 mm and a material thickness of 0.15 mm.
Each capsule is machined from a single piece of unmetallized nickel-silver alloy, in a single, simple 5-sided format. These components are cost-effective and easy for engineers to install onto a circuit board using Harwin's SMT shielding capsule tweezers. Secondary soldering is eliminated because these tweezers are soldered at the same time as the other components on the board. This avoids the risk of damaging sensitive circuitry from extreme heat during hand soldering.
Removable capsules also provide easy access to the underlying devices and circuitry when servicing, maintenance, or component replacement is required; the capsules can simply be disconnected and reinstalled as needed. This completely eliminates the cumbersome desoldering and solder removal required for servicing with other types of EMC capsules.
Thanks to the new products, Harwin's EMI/RFI shielding range offers sizes from 10 mm square up to 50 mm x 25 mm, with heights from 2.5 mm to 5 mm and material thicknesses from 0.15 mm to 0.30 mm. All are available from stock.
“Combating electromagnetic emissions is a critical aspect of modern electronic design, especially for those working with wireless communications,” says Neil Moore, Product Manager for EMC and Industrial Products at Harwin. “These simple Harwin shielding capsules and clips have gained widespread acceptance among electronics engineers. Now we are expanding the offering to help meet EMC requirements in smaller, handheld wireless applications.”.
