Embedded Systems
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- Category: Embedded Systems
Mouser Electronics, Inc. now has the Renesas Electronics RA6M3 AI/ML and RA4E1 AI/ML Reference Kits in stock. These reference kits are complete reference solutions designed to simplify the integration of artificial intelligence (AI) and machine learning (ML) technologies into peripheral and terminal systems. Based on the RA6M3 and RA4E1 32-bit RA microcontrollers, the kits enable rapid development of real-time analytics, audio, and vision applications.
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Nordic Semiconductor's Thingy:53 rapid prototyping platform is based on the nRF5340 system-on-a-chip (SoC). It features integrated motion, sound, light, and environmental sensors, making it an ideal platform for building proof-of-concept and prototype systems. The Thingy:53's housing boasts a completely updated design, based on the familiar form factor of the Thingy series.
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The Nordic Semiconductor nRF5340 Audio Development Kit is a platform designed for BLUETOOTH® "LE Audio," including everything needed to get started. The configurable nRF5340 Audio Kit functions as a USB dongle, allowing you to send or receive audio data from a PC, or it can serve as a business headset, streaming receiver, or True Wireless Stereo (TWS) earbuds. Two or more kits are recommended for most use cases.
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The Nordic Semiconductor nPM1300-EK PMIC Evaluation Kit enables easy evaluation and code-free configuration of nPM1300 power control ICs (PMICs). Connect to the nPM PowerUP application found in nRF Connect for Desktop and configure all nPM1300 settings via an intuitive GUI, then export them as code for implementation in a user MCU application.
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The Nordic Semiconductor nRF9160 Cellular IoT System-in-Package (SiP) is designed to meet the needs of emerging low-power cellular IoT applications. These applications include long battery life, low-cost deployment and maintenance, and scalability for billions of potential devices. The Nordic nRF9160 also provides ubiquitous network coverage in a miniaturized form factor that can fit almost anywhere.
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Infineon Technologies AG has announced the XENSIV™ Sensor Shield for Arduino, a versatile tool designed to evaluate smart sensor systems in smart homes and various consumer applications. This innovative board incorporates a wide range of sensors from Infineon's portfolio, along with Sensirion's SHT35 humidity and temperature sensor, streamlining its capabilities and improving the design journey for Infineon customers.
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DFI introduces the DFI QCS051 industrial motherboard with the Qualcomm®️ QCS6490 processor for advanced applications such as autonomous mobile robotics (AMR), automated guided vehicles (AGV), and Box PCs.
The DFI QCS051 is a compact 2.5-inch Pico-ITX industrial motherboard designed to excel in space-constrained environments. Leveraging the power of the QCS6490 processor, the QCS051 delivers performance that ensures smooth operation even in demanding industrial settings, whether deployed in smart logistics solutions or rugged industrial systems.
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The aviation industry's need for more modern, efficient, and lower-emission aircraft is driven by a global goal of sustainability and decarbonization. To meet these objectives, aviation power system developers are adopting electric drive systems as the trend toward More Electric Aircraft (MEA) gains momentum.
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SECO has announced the launch of its latest COM Express® module, which incorporates the recently released Intel® Atom® x7000RE series processors (Code: Armstrong Lake). The SOM-COMe-CT6-ASL leverages the robust capabilities of Intel® Next Gen Atom® processor technology and the versatility of the standard COM Express® to deliver an optimized combination of performance and reliability for embedded and highly robust edge applications.
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NeoCortec presented a new demonstration at their booth (Hall 3, Stand 526 in Embedded World) and in two of the exhibition halls. This demonstration illustrates the rapid and seamless development of complete sensor-to-cloud solutions using NeoMesh Click boards and IoTConnect cloud solution .
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congatec and Thomas-Krenn.AG have joined forces in a new collaboration: The two companies are developing an embedded server with special security features to meet EU requirements. Thanks to its modular design, the system can be upgraded in the future.
At the heart of the server is a congatec conga-HPC/sILH COM module. With Intel Xeon D1800 and D2800 processors, the module is based on the PICMG (PCI Industrial Computer Manufacturers Group) COM-HPC Server standard.
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congatec presents its first board-level product in line with its recently launched aReady strategy. Ready for immediate deployment in industrial use cases, the new 3.5-inch conga-HPC/3.5-Mini motherboard is designed for robust, high-performance, space-constrained IIoT applications based on COM-HPC Mini modules with extended temperature support from -40°C to +85°C.
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