Thanks to support for Thunderbolt and PCIe enhanced up to Gen5, modules based on the new COM-HPC standard open new horizons for developers in terms of data throughput, I/O bandwidth, and performance density. COM Express 3.1-compatible modules primarily help secure investments in existing OEM designs, including upgrade options for increased data throughput via PCIe Gen4 support.
The new COM-HPC and COM Express Computer-on-Modules offer up to 8% higher single-threaded and up to 5% higher multi-threaded performance thanks to soldered 13th Gen Intel Core processors compared to 12th Gen Intel Core processors. This performance boost is accompanied by greater energy efficiency thanks to an improved manufacturing process. Also new to this performance class (15-45W base power) are DDR5 memory support and PCIe Gen5 connectivity on select SKUs.
Both contribute to further improved thread performance and data flow. With up to 80 UEs and ultrafast encoding and decoding capabilities, the integrated Intel Iris Xe graphics architecture is ideal for enhanced graphics demands such as those found in video streaming and video-based situational awareness applications. All of these features deliver significant improvements across a wide range of industrial, medical, artificial intelligence (AI), and machine learning (ML) applications, as well as all types of embedded systems and edge computing with workload consolidation.
“The numerous improvements in 13th generation Intel Core processors contribute to making these new generations of COM modules truly exceptional. They offer the industry the opportunity to instantly upgrade existing high-end embedded systems and edge computing solutions, which is what makes this new release so extraordinarily significant for all our OEM customers and Value Adding Reseller partners,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec.
The new conga-HPC/cRLP COM module in COM-HPC Size A form factor and the compact conga-TC675 module based on the new COM Express 3.1 specification will be available in the following variants:
Application engineers can deploy the new COM-HPC modules on the congatec conga-HPC/uATX Micro-ATX application motherboard for COM-HPC Client type modules to instantly take advantage of all the benefits and improvements of these new modules in combination with ultra-fast PCIe Gen5 connectivity.
Datasheet for the new conga-HPC/cRLP COM module in COM-HPC Size A
Specifications sheet for the new conga-TC675 COM module in COM Express Compact Type 6
