Graphics and compute workloads benefit from up to 4 cores, 8 threads, and up to 96 graphics execution units for ultra-robust, massively parallel processing performance. Integrated graphics can be used as a parallel processing unit for convolutional neural networks (CNNs) or as an AI and deep learning accelerator. Using the Intel OpenVINO software toolkit, which includes optimized calls for OpenCV, OpenCL cores, and other industry-leading tools and libraries, workloads can be spread across CPU, GPU, and FPGA compute units to accelerate AI workloads, including computer vision, audio, speech, language, and recommendation systems.
The TDP is scalable from 12W to 28W, enabling immersive 4K UHD system designs with only passive cooling. The capabilities of the conga-HPC COM-HPC/cTLU module and the conga-TC570 COM Express Type 6 module have been combined in a design capable of real-time operation and also includes support for Real-Time Systems' real-time hypervisor for virtual machine deployments and workload consolidation in edge computing scenarios.
Scalable
processors for extreme temperatures ranging from -40 to +85°C. Both modules are the first to support PCIe x4 Gen 4 performance for connecting peripherals with massive bandwidth. Furthermore, designers can take advantage of eight PCIe Gen 3.0 x1 lanes. While the COM-HPC module offers the latest 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0 ports, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 ports compliant with the PICMG specification. For networking, the COM-HPC module offers 2x 2.5 GbE, while the COM Express module runs 1x GbE, with both supporting TSN. Audio is provided via I2S and SoundWire in the COM-HPC version, and HDA in the COM Express modules. Comprehensive board support packages are provided for all major RTOSs, including hypervisor support for real-time systems, as well as Linux, Windows, and Android.
The two COM-HPC modules, based on the 11th generation Intel Core processor and the COM Express Compact Type 6, are available in the following extended temperature range options.
- Details
- Category: Embedded Systems
Congatec modules with 11th generation Intel Core processors
Congatec introduces six new Computer-on-Modules (COMs) with 11th Gen Intel Core processors for extended temperature ranges. Based on the new Tiger Lake low-power, high-density SoCs, these new wide-temperature environment modules offer increased CPU performance and nearly 3x higher GPU performance, along with support for the latest PCIe Gen4 and USB4 technologies.
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