The new COM-HPC standard offers a wide range of high-speed interfaces, including PCIe Gen 4 and USB 4.0, a high-speed connector, and a comprehensive suite of remote management features.
Using COM-HPC in the design of 11th generation Intel Core processors provides immediate benefits to developers: PCIe Gen 4-compatible connectivity, full USB 4.0 bandwidth, 2.5 GbE, SoundWire, and MIPI-CSI. Those anticipating the need for more or higher-performance PCIe or Ethernet interfaces with up to 25 GbE should also prioritize COM-HPC. Furthermore, developers looking to scale their high-performance systems to edge and fog server performance with a single standard have a compelling case for implementing everything on COM-HPC. Finally, the prospect of using modules that offer more comprehensive remote management capabilities is another reason to purchase and test the new COM-HPC standard evaluation platform.
Designed for evaluation purposes, the conga-HPC/EVAL-Client ATX-compatible carrier board for COM-HPC includes all the necessary R&D interfaces for programming, firmware flashing, and resetting. The new COM-HPC board also incorporates all the interfaces specified by the new COM-HPC Client standard and supports an extended operating temperature range of -40°C to +85°C. The board supports COM-HPC sizes A, B, and C and comes with various LAN data bandwidths, data transfer methods, and connectors. It is offered in different versions to provide maximum flexibility for customers, including Ethernet KR, up to 2x 10GbE, 2.5GbE, and 1GbE support. The board also features two high-performance PCIe Gen4 x16 slots for the latest high-performance expansion cards. Among the boards in the range, the carrier can run even higher-performance interfaces of up to 4x25 GbE, making this evaluation platform ideal for massively connected edge devices.
The cooling solution for the new COM-HPC modules is available in three different variants and accommodates the entire configurable TDP range of 11th generation Intel Core processors (12-28W). The new COM-HPC modules are available in the following processor configurations (see table).
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- Category: Embedded Systems
Motherboard for the ecosystem with new PICMG COM-HPC standard
Congatec presents the first carrier board and cooling solutions that form the foundation of the new ecosystem for the new PICMG COM-HPC standard. These are designed to accelerate the use of congatec's COM-HPC modules based on the latest 11th Gen Intel Core processors (codenamed Tiger Lake).
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