It comes with an additional 64 Mbit of onboard memory and a board configuration available in the Zephyr/nRF Connect SDK. Users can easily access the module's various interfaces, including GPIO (all 32), NFC-A, current measurement pins, and the integrated Segger J-Link debugger, making the evaluation board ideal for assessing the B511-1C PAN module and quickly prototyping applications for lighting, home appliances, industrial sensors, medical devices, wearable healthcare devices, energy management devices, and solar farms.
Panasonic Industry's new small and cost-effective B511-1C Bluetooth PAN module offers high performance and ample memory while minimizing current consumption thanks to the Nordic nRF54L15 single-chip controller.
A specific number of GPIO pins are located on the edge of the module, while the remaining GPIO pins are on the bottom pad, providing access to all 32 GPIO pins on the chip. With its unique hybrid package design combining slotted holes and LGA, the module maintains the small size of a 2-cent coin. This combines the advantages of both worlds without compromising size and offers one of the best pin-to-size ratios for Bluetooth modules currently available.
The PAN B511-1C Bluetooth module will be certified to CE RED, FCC, ISED, and MIC standards. Samples are available now, and series production is scheduled to begin in June 2025.
For more information on the latest PAN B511-1C Bluetooth module, click HERE or visit the PAN B511 Wireless Connectivity Development Center.