The SM2S-IQ615 SMARC (Smart Mobility ARChitecture) and TRIA OSM-LF-IQ615 (Open Standard Module) modules incorporate the Dragonwing IQ-615 processor and integrate the Qualcomm® Kryo™ Gen 4 CPU with a 64-bit Octa-Core processor and a powerful Qualcomm® Adreno™ 612 GPU, bringing performance and energy efficiency to Linux-based edge applications. The Qualcomm® Hexagon™ V66 DSP with Dual Hexagon Vector enables developers to create more powerful, cost-effective, and energy-efficient machine learning applications.

“We are proud to supply these modules based on the Dragonwing IQ-6 series,” said Markus Mahl, Senior Product Manager at Tria Technologies. “Our collaboration with Qualcomm Technologies ensures that Tria customers are the first to benefit from the latest advancements in edge AI processing capabilities.”.

Developers can now fully launch their projects with the Dragonwing IQ6 series, from developing and optimizing software for the Dragonwing IQ-615 or fine-tuning the AI ​​model to conducting performance testing, benchmarking, and real-world validation. Both modules include Yocto Linux BSP as standard and can also be ordered with support for the Ubuntu Linux OS.

“Dragonwing processors are designed to deliver high-performance, low-power edge computing with AI on-device, enabling applications in these sectors to reach new levels of innovation and efficiency,” said Christian Bauer, Product Marketing Manager at Tria Technologies. “In addition to our proven design expertise, embedded computing boards facilitate rapid development and deployment across a wide range of industries. The TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules are designed to offer SMARC and OSM form factors, respectively, which help accelerate product development cycles by providing scalability and flexibility that reduce costs and simplify design through a wide variety of possible interfaces.”.

“The addition of the SM2S-IQ615 and OSM-LF-IQ615 modules to Tria Technologies’ portfolio marks a significant milestone in our shared commitment to edge AI development,” said Douglas Benitez, Senior Director, Business Development at Qualcomm Europe, Inc. “By bringing the powerful edge computing capabilities of the Dragonwing IQ-6 series to market, Tria Technologies empowers customers to accelerate industrial innovation in their industrial gateways, machine vision solutions, HMIs, controllers, and other next-generation equipment.”.

Developers can also take advantage of advanced security features such as Secure Boot, Secure Debugging, TrustZone, Qualcomm® Trusted Execution Environment, and the hardware-backed KeyStore system. Both modules also offer fast, low-power LPDDR4 memory technology and up to 256GB of eMMC Flash storage.

A wide range of interfaces are available for embedded applications, including Dual Gigabit Ethernet, PCI Express Gen. 2, USB 2.0/3.1, DP v1.4, MIPI-DSI, LVDS, and up to 3x MIPI CSI-2 for connecting cameras. This makes it ideal for embedded vision, machine learning, and multimedia applications.

Both modules are supplied with development kits and board encapsulations that accelerate integration and prototyping.

The SM2S-IQ615 module is compliant with the SMARC 2.2 standard, which facilitates integration with SMARC motherboards, while the OSM-LF-IQ615 module is compliant with the OSM 1.2 (OSM-SL) standard.

Tria Technologies is the leading supplier of SMARC and OSM modules, as it has the widest catalog of this type on the market.

SMARC is one of the best and most future-proof standards for embedded designs with a small form factor, making it ideal for products that require embedded computing without compromising processing power.

OSMs are designed to provide the smallest possible form factor with a strong emphasis on versatility. In a growing number of IoT applications, this standard helps combine the advantages of modular embedded computing with increasingly demanding requirements for cost, space, and interfaces.