This module, which complies with OSM Specification 1.2 (Open Standard Module), is supplied in a tiny package of just 45 x 45 mm (Size L), but thanks to the powerful NXP i.MX 95 SoC it allows developers and design engineers to increase the performance of advanced embedded and edge AI systems.
The module contains a 2GHz six-core Arm Cortex-A55 application processor and two Arm real-time processors: an 800MHz Arm Cortex-M7 and a 333MHz Arm Cortex-M33. It also incorporates an Arm Mali graphics processing unit (FPU), a 4K decoding/encoding vision processing unit (VPU), NXP's new eIQ Neutron neural processing unit (NPU), and a new image signal processor. This enables it to deliver powerful AI-accelerated vision processing and supports edge AI workloads such as predictive maintenance, object classification, and production line monitoring, among others.
Tria's OSM-LF-IMX95 module is suitable for developing next-generation low-power edge platforms that require functional safety, advanced security, and high-performance connectivity; for example, in industrial automation and robotics, machine vision systems, and mobile devices.
Advanced security features are integrated into the OSM-LF-IMX95 module. For example, the integrated EdgeLock Secure Enclave subsystem simplifies the implementation of critical security features such as secure boot, cryptography, trust provisioning, runtime verification, key management services, secure remote management, secure over-the-air (OTA) updates, and a dedicated cryptographic engine.
“We are pleased to introduce the OSM-LF-IMX95 module, which offers high computing performance, integrates AI/vision functions, and robust connectivity in a small form factor for direct soldering without a connector,” said Markus Mahl, Senior Product Manager at Tria Technologies. “System architects, design engineers, and developers will be able to take full advantage of the NPX i.MX95 processor's features to achieve cost-optimized designs and shorten time to market with a ready-to-use standard module.”.
