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- Category: Integrated Circuits
ROHM's ultra-compact TLR1901GXZ CMOS operational amplifier (op amp) delivers the lowest operating circuit current in the industry. This integrated circuit is optimized for use as a measurement sensing amplifier in size-constrained applications such as handheld measuring instruments, wearable devices, and indoor motion detectors.
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- Category: Current Affairs
Farnell will distribute connectivity solutions from Digi International, a global provider of Internet of Things (IoT) connectivity products, services and solutions, expanding Avnet's existing relationship with Digi and enhancing Farnell's wireless communications portfolio.
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- Category: Current Affairs
Global technology solutions provider Arrow Electronics, Inc. announced the addition of AirBorn, a Molex company, to its portfolio of interconnect, passive, and electromechanical (IP&E) components in North America and EMEA. The addition of AirBorn to Arrow's product offering reinforces the long-standing and deep collaboration between Arrow and Molex.
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- Category: Converters
Norvento TECHnPower, Norvento's technology brand, presents nXL, its new range of high-power bidirectional converters designed for large-scale applications. The nXL family of equipment reaches 622 kVA/m³ and provides up to 9 MVA over 20 feet, including a medium-voltage switchgear and power transformer.
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- Category: Integrated Circuits
In environments where multiple communication interfaces and protocols coexist, interoperability between devices requires reliable bus translators. Integrated circuits that bridge interfaces allow two systems using different protocols to communicate without requiring the designer to implement the entire conversion at the software or hardware level.
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- Category: Assets
Mecter SL is pleased to announce the launch, by its represented company Holtek, of the new generation of low-dropout linear voltage regulators, the HT75Rxx-1 and HT75Rxx-7 series.
The HT75Rxx-1 series is characterized by its ultra-low standby current of only 1 μA typical, making it an ideal choice for portable devices and applications where energy efficiency is a priority.
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- Category: Sensors
Mouser now offers Omron Industrial Automation's E3AS-HF time-of-flight (ToF) laser sensors. These sensors provide stable, continuous detection of hard-to-detect target levels for industrial automation, manufacturing, and complex environments.
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- Category: Sensors
Mouser offers the new AF013x Hyperlux™ ID 1.2MP indirect time-of-flight (iToF) sensors from onsemi. The AF013x are array sensors for 3D imaging of fast-moving objects for applications in factory automation, drones, computing, metrology, robotics, machine vision, biometrics, future retail, smart logistics, and 3D modeling.
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- Category: Technology
Paul Motzki specializes in two distinct smart materials technologies. The first involves shape-memory materials: thin bundles of wire or sheets made of nickel-titanium alloy that contract or expand depending on the presence of an electric current. These materials allow Paul Motzki and his team to build flexible actuators, such as lightweight robotic grippers.
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- Category: Seminars
DigiKey has launched the fifth season of its Factory Tomorrow video series, titled "Behind the Robot." This new season features experts exploring the infrastructure and innovation that make modern robotic manufacturing and automation possible.
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- Category: Converters
The THL 40WI series expands Traco Power's existing DC/DC converter portfolio with 40-watt converters in a 1" x 1" enclosure. Focusing on combining cost-effectiveness with quality, this series of high-performance isolated DC/DC converters is suitable for a wide range of applications. The series comes in a protected, encapsulated metal housing measuring 1" x 1" x 0.43" and offers integrated on/off and remote dimming functions.
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- Category: Current Affairs
Large-format 3D printing has established itself as a key technology in demanding industrial sectors such as automotive and urban design, thanks to its ability to manufacture large parts without assembly. However, its large-scale adoption faces significant technical challenges such as warping and cracking, caused by thermal stresses during the manufacturing process.
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