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- Category: Technology
Semiconductor packaging has evolved from traditional 1D printed circuit board levels to next-generation 3D hybrid junctions at the wafer level, achieving interconnect steps as small as a single micrometer and bandwidths exceeding 1,000 GB/s. Key parameters include power, performance, surface area, and cost. Energy efficiency is improved through innovative packaging techniques, while performance benefits from shorter interconnect steps.
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- Category: Technology
Head-up displays (HUDs) for cars are being met with great enthusiasm. The increased use of technology while driving, and the fact that drivers have to take their eyes off the road to look at the dashboard and central information displays (CIDs), has led to more traffic accidents over the years. Drivers must look away from the road to check on-board diagnostics (ABDs), GPS navigation, select music, and so on.
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The conference running alongside the PCIM 2024 exhibition offers a diverse program with over 500 presentations. The four-stage program focuses on the latest products, developments, and trends in the industry and will feature presentations from leading specialists.
In Hall 5, visitors can attend the new Smart Power System Integration Stage, showcasing innovative solutions and application examples for the challenges of power electronics production: from Smart Power Embedding to Integrated Smart Power Circuits.
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- Category: Embedded Systems
DFI introduces the DFI QCS051 industrial motherboard with the Qualcomm®️ QCS6490 processor for advanced applications such as autonomous mobile robotics (AMR), automated guided vehicles (AGV), and Box PCs.
The DFI QCS051 is a compact 2.5-inch Pico-ITX industrial motherboard designed to excel in space-constrained environments. Leveraging the power of the QCS6490 processor, the QCS051 delivers performance that ensures smooth operation even in demanding industrial settings, whether deployed in smart logistics solutions or rugged industrial systems.
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One of the most interesting things about working as a developer is that the work can vary greatly. One day we might be analyzing the details of the serial interface on a microcontroller, another day we might be configuring data acquisition for a new project, and by the end of the week, we might be trying to power a 20 kW motor. Each task requires specific knowledge and skills, such as electronics, data protocols, software programming, or electrical safety.
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- Category: Batteries
Current commercial lithium-ion batteries use liquid organic electrolytes, which have significant advantages (high conductivity and excellent wettability on electrode surfaces). However, the obvious and unavoidable drawbacks of liquid electrolytes are electrochemical instabilities and potential hazards, in addition to low ion selectivity. Compared to liquid electrolytes, solid electrolytes offer greater safety and thermal stability. 2,3
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The Open Compute Project (OCP), a non-profit organization that shares data center product designs and best practices among companies, recently published its Open Rack Version 3 (ORV3) specification. The most significant change in the specification is the shift from a 12V to a 48V architecture. This is the second in a five-part series highlighting Analog Devices' reference design for the Battery Backup Unit (BBU).
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The aviation industry's need for more modern, efficient, and lower-emission aircraft is driven by a global goal of sustainability and decarbonization. To meet these objectives, aviation power system developers are adopting electric drive systems as the trend toward More Electric Aircraft (MEA) gains momentum.
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- Category: Other Components
Toshiba Electronics Europe GmbH ("Toshiba") has launched a new range of 650V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 in TO-247 packages are the first high-speed diode (HSD) products in the next-generation DTMOS VI series. This generation features a superjunction structure suitable for switched-mode power supplies in demanding applications such as data centers and power conditioners for photovoltaic (PV) generators.
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- Category: Current Affairs
At the event taking place in Nuremberg, Germany, from June 11-13, experts from both companies will demonstrate to visitors how Yamaha's advanced 1 STOP SMART SOLUTION equipment can boost productivity and quality control with automated features. These include the YRP10 screen printing system, the YRM20 SMD assembly system, the YRi-V 3D AOI system, and new software that includes inspection and troubleshooting tools.
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Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for smart, low-power edge solutions deployed on field-programmable gate arrays (FPGAs). Neuronix AI Labs offers neural network scatter optimization technology that reduces power, size, and computation for tasks such as image classification, object detection, and semantic segmentation, while maintaining high accuracy.
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- Category: Current Affairs
DigiKey has announced the expansion of its product portfolio through a strategic worldwide distribution partnership with 3PEAK, a high-performance semiconductor technology developer.
DigiKey's broad product range now includes cutting-edge 3PEAK products such as amplifiers, isolation, interfaces, data converters, LDOs and voltage references, supervisors, controllers, DC-DC converters, embedded MCUs, and battery management systems.
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