VISION brings together leading international manufacturers and integrators of image processing systems to present their latest products, systems, and complete solutions for industrial and non-industrial applications. This year's innovations are primarily focused on 3D image processing. Other exciting developments are being showcased in the field of CMOS image sensors/cameras, easy system integration via vision interfaces or CoaXPress USB3, and much more. Here are some of the star products:
5D Time-of-Flight Camera
represents the next generation of sensor systems, suitable for robotics, automation, and people counting. The Argos3D-P320 is a novel depth sensor based on the time-of-flight (ToF) principle. It features an intelligent depth sensor IC and a high-resolution 2D CMOS sensor. The IC provides depth information and grayscale values simultaneously for each pixel, while the 2D CMOS image sensor captures scenes at up to 1080p resolution. This allows for the analysis of images based solely on 3D depth information or in combination with 2D data. Thanks to active infrared illumination, the sensor can provide both 3D and 2D information.
Mobile robots with 3D panoramic perimeter view:
To enhance the capabilities of mobile robots and ensure safe operation, for example, in situation recognition, navigation, or inspection, the Austrian Institute of Technology (AIT) has developed the so-called dynamic vision sensor. In combination with a rotating camera, this innovative sensor is the key component of a high dynamic range panoramic stereo camera, enabling the capture of 360-degree stereo panoramic images and up to ten 3D panoramic images per second. Thanks to its high dynamic range, this sensor even allows for shooting in low-light conditions. This technology is being presented for the first time at VISION 2014.
3D Adhesive Bead Inspection: The World's First 360° Sensor Inspection.
In the automotive industry, bonded seams are used to install windshields, and their quality must be 100% guaranteed. Isra Vision's 360° inspection allows for the thorough inspection of even curved adhesive beads. To achieve this, the systems integration company has developed the Seamstar3D sensor head, which is now available with an optimized optical and technical configuration, thanks to a new and extraordinary support structure made of a special 3D-printed material. According to the manufacturer, its intelligent design makes it the world's first sensor with a circumferential view. An optimized version is being presented at VISION 2014.
3D online testing system for micrometer-precise hole inspection.
Three-dimensional holes, internal threads, tape measurements, fine internal grooves, blind holes, and even cylindrical objects can be measured using the BoreInspection system, developed by the French manufacturer Mesure-Systems-3D. Furthermore, complex parts with grooves, edges, or collars can be inspected directly on the production line using the non-contact 3D testing system, covering up to 50 different features. The system is being presented for the first time in Germany at the VISION 2014 trade fair.
High-speed camera with CoaXPress.
High-quality applications include detailed quality control for flat panel display manufacturing and printed circuit board production, particle-based current measurement technology, 3D measurements, and surface inspection. High-speed, high-resolution cameras are essential here, such as the new, extremely compact 25-megapixel (80 fps) EoSens 25CXP digital CMOS high-speed camera, which Mikrotron is presenting for the first time at VISION 2014. "With a powerful, real-time CoaXPress data interface and outstanding performance, it meets the high demands of the high-end sector," says Christian Pilzer, Managing Director of Mikrotron.
USB3 vision cameras offer easy integration in the life sciences and automation sectors.
At VISION 2014, Baumer is presenting its expanded VisiLine camera series with a USB3 vision interface. The available camera models include Sony VGA and 1.2-megapixel CCD sensors and are characterized by frame rates of up to 42 frames per second and excellent image quality. The fast VGA CMOS sensor stands out with its even higher frame rates of 373 frames per second. "The single-cable, plug-and-play camera is incredibly easy to integrate, and thanks to its numerous features, the VisiLine series offers endless possibilities for industrial imaging and life science applications," says Volker Zipprich-Rasch, Head of Product Management and Marketing.
3D Scanning: From Coins to Sofas.
David Vision Systems is presenting the new SLS-2 scanner for the first time at VISION 2014. This scanner uses structured light, enabling precise 3D scanning in seconds. It is mobile and can be easily positioned in front of the object. Its modular design allows for flexible adaptation of the scanner to the size of the object—from a coin to a sofa. The 3D model can optionally be displayed on the screen with color textures. Compared to its predecessor, the SLS-2 now features a movable camera cover, making it much easier to adjust the scanner to a new object size. No screws are needed to position the camera.
Top-quality traffic monitoring.
Smartek Vision's Giganetix Plus, one of the world's leading cameras, incorporates Sony's innovative IMX174 CMOS image sensor, "which promises unprecedented values in terms of sensitivity, dynamic range, and background noise, while simultaneously providing top-quality images of moving objects," explains Dr. Ronald Müller, Product Marketing Manager at Framos. The exclusive distributor of Smartek Vision is presenting the camera at VISION 2014 under the Traffic VISION theme: "It's a very cost-effective solution for applications, especially traffic monitoring, but also for medical diagnostics; in general, it's useful for checking moving objects or integrating into applications in low-light conditions," comments Dr. Müller. SWIR camera
technology for demanding tasks in photovoltaics.
Allied Vision Technologies' flagship product at VISION 2014 will be the Goldeye series of infrared cameras. These are entirely new developments that set new standards in the SWIR (Short-Wave Infrared) camera segment. Thanks to its InGaAs sensor, it is especially sensitive to infrared radiation between 900 and 1,700 nm. This makes it suitable for demanding image processing applications outside the visible spectrum in industrial and scientific environments, from quality assurance in the photovoltaic and semiconductor industries to spectroscopy.
Checking rubber O-rings in free fall:
With its "Fly" system, Doss can monitor rubber O-rings during their descent and separate conforming parts from non-conforming ones. A throughput of seven to nine parts per second can be achieved, depending on the failure characteristics and the dimensions of the parts. This is just one of the many patented solutions developed by this company. Visitors to VISION 2014 can take their own parts to be tested on the Doss test bench. Experts will help them find a suitable solution.
Many avenues for surface inspection of railway products:
With the help of a demonstration system, Stemmer Imaging is presenting at VISION 2014 a wide range of image processing technologies that can be used for surface inspection of railway products. Two line cameras from Teledyne Dalsa and JAI, a Contact Image Sensor (CIS) from Mitsubishi Electric, and a triangulation camera from Automation Technology are the components of the demonstration system. All sensors operate autonomously and detect the different characteristics of an aluminum sheet moving along a linear table. Each camera is used as an example for potential special evaluation.
Navitas completes the acquisition of Claros to incorporate IVR technology for AI data centers
Navitas Semiconductor has completed the acquisition of Claros, a company specializing in power management technologies and integrated voltage regulators (IVR) for processors used in artificial intelligence infrastructures.
The operation, which had been previously announced,...
