The [Glass Core Substrates Market and Development Trends Report] examines the emerging market for glass core substrates, a next-generation packaging technology that is attracting increasing attention as artificial intelligence and high-performance computing (HPC) drive demand for larger and more advanced semiconductor packages.
“As chipmakers seek new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, senior director of Market Intelligence at SEMI. “Glass-core substrates are being evaluated as a potential solution for future high-end packages, as they can help support larger package sizes, finer interconnects, and greater dimensional stability compared to conventional package substrate materials. This new report helps industry stakeholders understand where glass-core substrates can fit into the next phase of package technology and what challenges need to be addressed to achieve wider adoption.”.
The report highlights the growing activity and investment in the sector surrounding glass-core substrates, as companies prepare for the next phase of advanced encapsulation, and offers an independent view of the technology's market potential, its state of development, the main players and the barriers that still exist to its commercialization.
According to the report's market development scenarios, initial production could begin around 2028 in selected high-performance applications, with adoption expanding over time to larger and more complex package architectures. Based on the average of its positive, base, and negative scenarios, the report forecasts a compound annual growth rate (CAGR) of 67.2% between 2028 and 2040. It also describes an increasingly active global development ecosystem, with companies and research organizations in Asia, North America, and Europe driving glass-core substrate technologies.
Key topics covered in the report include:
Market outlook and adoption scenarios for glass core substrates
; Technology drivers and barriers to commercialization;
Anticipated applications in AI, HPC, advanced processors, co-packaged optics, and image sensors;
Company activities in the substrate, glass materials, equipment, processing, inspection, and related supply chain segments;
Development centers, consortia, and supply chain structure;
Forecast scenarios through 2040.
