By combining Polar's extensive experience in power semiconductor manufacturing and its continuous capacity expansion with Nexperia's leading power MOSFET technology, the collaboration addresses the growing demand in AI server infrastructure, robotics, industrial applications, and automotive.
Polar Semiconductor has a high-volume wafer fabrication facility in Minnesota and extensive experience in power processes. With over six decades of semiconductor manufacturing experience and more than 25 years in automotive production, Polar is IATF 16949 certified and committed to zero-defect manufacturing. As part of this collaboration, Nexperia is developing a broad portfolio of next-generation power MOSFETs, encompassing a wide variety of voltage classes and package types to meet the diverse requirements of power electronics.
“Investing in future technologies and expanding our power MOSFET portfolio are central to Nexperia’s strategy,” said Fredrik Öberg, Managing Director of Nexperia’s MOS Business Group. “Our MOSFETs are recognized for their industry-leading quality and reliability, and we are delighted to collaborate with Polar Semiconductor, a partner that shares our unwavering commitment to zero-defect manufacturing and advanced power device production.”.
“At Polar, our vision is to create a differentiated wafer foundry focused on power semiconductors, sensors, and high voltage. The partnership with Nexperia—one of the world’s leading power semiconductor companies—to bring its power MOSFET roadmap to market underscores the strength of our strategy and the progress we have made through targeted investments,” said Reza Kazerounian, CEO of Polar Semiconductor.
Stefan Tilger, interim CEO of Nexperia, confirms: “This collaboration is an important step in strengthening Nexperia’s long-term manufacturing and supply chain strategy. By working closely with Polar Semiconductor, we ensure reliable capacity and provide our customers with a solid, stable, and resilient supply base to support future growth.”
Nexperia's power MOSFET range is designed to help customers select the right balance between switching performance and robustness for demanding applications. Over the past few decades, the company has continuously advanced packaging technologies, including copper clip solutions such as LFPAK and CCPAK, as well as the MLPAK package, to deliver improved electrical performance, robustness, and thermal efficiency.
