The solution is being presented in collaboration with Advantest and Teradyne, manufacturers of automated test equipment (ATE), who will integrate Tessent Silicon Executable into their respective platforms.
The goal is to facilitate the application of test patterns in different environments and allow the results obtained to be used subsequently in debugging, diagnostics, and analysis processes.
The integration of test pattern generation and execution
in Tessent Silicon Executable expands Siemens' semiconductor testing workflow, encompassing everything from design function testing (DFT) insertion to pattern execution on manufactured devices. This process includes pattern generation and preparing the necessary test material. The new software uses the material generated by Tessent, adapts it to the appropriate execution environment, and applies the tests to the device.
The results are then returned to Tessent workflows for use in debugging, diagnostics, and analysis. This integration allows the different phases of the testing process to be connected within the same ecosystem of tools.
Testing via High-Speed Interfaces and Protocols:
The software is designed to facilitate the execution of scan tests using high-speed interfaces and protocols. According to Siemens, the increasing complexity of integrated circuits, operating frequencies, multi-chip designs, and new transistor technologies are increasing the demands on semiconductor testing.
These conditions can translate into longer test times and more complex execution requirements. Tessent Silicon Executable allows the application of patterns generated by Tessent in different environments, including automated test equipment, system-level testing, test benches, and in-system environments.
The company emphasizes the ability to maintain a consistent execution and analysis procedure across these environments.
Ankur Gupta, Executive Vice President and Head of Integrated Circuits at Siemens EDA, notes that the software directly connects test creation and execution, facilitating the use of results in subsequent diagnostic and analysis processes.
Integration with Advantest V93000 and Link Scale:
One of the manufacturers participating in the launch of Tessent Silicon Executable is Advantest. The company will integrate the software into its V93000 testing platform with Link Scale.
The collaboration also includes its use in pre-fabrication silicon verification activities and in DFT laboratory engineering using SiConic.
Juergen Serrer, Technical Director at Advantest, emphasizes that this integration will allow for a more coherent workflow between the development, verification, and production phases.
The addition of Tessent Silicon Executable to these tools is aimed at facilitating the continuity of testing processes throughout the device development lifecycle.
Teradyne Integrates Tessent Silicon Executable into UltraFLEXplus.
Teradyne is also participating in the launch by integrating Siemens' software into its UltraPort instrument for the UltraFLEXplus platform. According to the company, this integration will allow SSNs to be run over PCIe using PCIe Gen 6 interfaces. Teradyne presents this capability as a standardized way to apply this type of testing using its platform of automated test equipment.
Shannon Poulin, president of Teradyne's Semiconductor Testing group, emphasizes the importance of the mechanisms used to transfer and execute test content on devices with advanced packaging. The company notes that the integration of Tessent Silicon Executable with UltraPort will improve performance and reduce test times.
A common workflow for different test environments,
Tessent Silicon Executable is designed to connect pattern generation tools with the systems used to run them on silicon. Its operation allows the use of content generated by Tessent in the corresponding test environment and the retrieval of results for further analysis. Siemens proposes this capability to facilitate correlation between different test environments and reduce the time required to prepare pattern execution.
The solution also aims to address the needs of multichip designs and devices using advanced packaging technologies.
Expanding the Tessent Ecosystem:
With the launch of Tessent Silicon Executable, Siemens adds a new tool to its ecosystem of solutions for semiconductor design and testing. The application complements existing design functions for testability, pattern generation, silicon testing, debugging, diagnostics, and analysis.
Collaboration with Advantest and Teradyne will enable the integration of these capabilities into automated test platforms, expanding pattern execution possibilities through high-speed interfaces.
