In recent years, the rapid electrification of automobiles has been driving efforts toward a decarbonized society. Electric vehicles utilize higher battery voltages to extend cruising range and improve charging speed, creating a demand for greater power from over-body capacitors (OBCs) and DC-DC converters. Simultaneously, there is a growing market demand for greater miniaturization and reduced weight in these applications, requiring technological advancements that improve power density—a key factor—while also enhancing heat dissipation characteristics that might otherwise hinder progress. ROHM's HSDIP20 package addresses these technical challenges, which were previously difficult to overcome with discrete configurations, thus contributing to both increased performance and reduced powertrain size.
The HSDIP20 incorporates an insulating substrate with excellent heat dissipation properties that suppresses chip temperature rise even during high-power operation. When comparing a typical OBC PFC circuit using six discrete, top-cooled SiC MOSFETs with ROHM's 6-in-1 module under the same conditions, the HSDIP20 package was found to be approximately 38°C cooler (at 25 W operation). This high heat dissipation performance supports high currents even in a compact package, resulting in an industry-leading power density more than three times that of discrete, top-cooled modules and more than 1.4 times that of similar DIP modules. As a result, in the aforementioned PFC circuit, the HSDIP20 can reduce the mounting area by approximately 52% compared to discrete top-cooled configurations, which greatly contributes to the miniaturization of power conversion circuits in applications such as OBCs.
In the future, ROHM will continue to advance the development of SiC modules that combine miniaturization with high efficiency, while focusing on the development of automotive SiC IPMs that provide greater reliability in a smaller format.
Product range
Application Examples:
Power conversion circuits such as PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics sectors.
- Automotive systems: On-board chargers, electric compressors, and much more.
- Industrial equipment: Electric vehicle charging stations, V2X systems, AC servos, server power supplies, photovoltaic inverters, power conditioners, etc.
Sales Information
Availability: OEM quantities (April 2025)
evaluation kits
are also available: one for dual-impulse testing and another for three-phase full-bridge applications, allowing for evaluation under near-real-world circuit conditions.
For more information, please contact a sales representative or visit the contact page on the ROHM website.
EcoSiC
™ is a brand of silicon carbide (SiC) devices that are gaining attention in the power device field by demonstrating performance even higher than that of silicon (Si). ROHM independently develops essential technologies for the advancement of SiC, from wafer fabrication and production processes to packaging and quality control methods. At the same time, we have implemented an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.
EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.
*ROHM study of April 24, 2025
