These modules, available in a wide variety of topologies, including half-bridge, full-bridge, three-phase, and PIM/CIB configurations, give designers the flexibility to optimize system performance, cost, and architecture. BZPACK mSiC modules have been tested to meet HV-H3TRB standards, which require over 1,000 operating hours, providing the confidence needed for use in industrial and renewable energy applications. With a 600V CTI (Comparative Tracking Index) housing, stable Rds(on) across various temperature ranges, and aluminum oxide (Al₂O₃) or aluminum nitride (AlN) substrates, the modules offer superior insulation, thermal management, and long-term durability.
“The introduction of our BZPACK mSiC power modules reinforces Microchip’s commitment to providing robust, high-performance solutions for the most demanding power conversion environments,” said Clayton Pillon, vice president of Microchip’s High Power Solutions business unit. “Our advanced mSiC technology empowers customers to develop efficient and durable systems for the industrial and sustainability markets.”.
BZPACK modules are characterized by their compact, boardless design, solderless snap-in terminals, and optional pre-applied Thermal Interface Material (TIM) to streamline production and reduce system complexity. These versatile options accelerate assembly, improve manufacturing consistency, and facilitate multi-vendor availability through industry-standard form factors. Furthermore, the modules are designed for pin compatibility, simplifying their use.
Microchip's MB and MC families of mSiC MOSFETs offer robust solutions for industrial and automotive applications and include options that comply with the AEC-Q101 standard. These devices support common gate-source voltages (VGS ≥ 15V) and are supplied in standard packages for easy integration. Their compliance with the HV-H3TRB standard demonstrates their long-term reliability by helping to reduce the risk of failures due to leakage or moisture-induced breakdown. The MC family incorporates a gate resistor that improves switching control, maintains low switching energy, and enhances stability in multi-chip module configurations. Current models are available in TO-247-4 Notch and unpackaged (waffle pack) formats.
