SiC diodes exhibit stable temperature characteristics and ultra-short reverse recovery time compared to silicon-based devices, making them ideal for high-speed switching. With extremely stable low forward voltage at high temperatures, SiC SBDs also ensure minimal reverse current.
Compared to the single-gang SBD structure of the 2nd generation, this 3rd generation incorporates a PN junction structure along with a Schottky barrier, ensuring durability in bipolar operation.
Overall, these features contribute to the ongoing trend of high efficiency, high power density, and very robust designs.
Key Specifications [650V / 10A Product Rated]
V<sub>F </sub> @ 10A (25°): typ. 1.35V
V<sub>F </sub> @ 10A (150°): typ. 1.44V
I<sub>R</sub> (25°): typ. 0.03μA @ 650V
Max. Temperature: 175°
IFSM 50Hz, 1 pulse: 82A
Third-generation SiC SBDs in A-220AC packages are now available.
Low
-current devices in D2PAK (LPTL) packages will be available in June.

