This allows for high power handling despite its compact size and low profile. It is ideal for industrial equipment such as server power supplies and energy storage systems (ESS) where power density is constantly increasing and low-profile components are required to enable the design of miniaturized products.
In applications such as AI servers and compact photovoltaic inverters, the trend toward higher power ratings runs parallel to the conflicting demand for miniaturization, requiring power MOSFETs to achieve higher power densities. Particularly in totem-pole PFC circuits for thin power supplies, often of the so-called "pizza box" type, stringent requirements mandate thicknesses of 4 mm or less for the discrete semiconductors.
ROHM's new product addresses these needs by reducing the space occupied by components by approximately 26% and achieving a low profile of 2.3 mm thick, roughly half that of conventionally packaged products. Furthermore, while most standard TOLL-encapsulated products are limited to a nominal drain-source voltage of 650 V, ROHM's new products support up to 750 V. This allows for lower gate resistance and a greater safety margin for overvoltages, which helps reduce switching losses.
The range consists of six models with conducting resistances ranging from 13 mΩ to 65 mΩ, with series production beginning in September 2025. These products are available for purchase online from retailers such as DigiKey, MOUSER, and Farnell. Simulation models of all six new products are available on the official ROHM website to facilitate rapid circuit design evaluation.
Product range
Application examples
• Industrial equipment: power supplies for servers and AI data centers, photovoltaic inverters and energy storage systems (ESS)
• Consumer equipment: general power supplies
EcoSiC
™ is a brand of devices that utilize silicon carbide (SiC) and is attracting attention in the power device field by demonstrating performance even superior to that of silicon (Si). ROHM independently develops technologies essential to the evolution of SiC, from wafer fabrication and production processes to packaging and quality control methods. At the same time, we have implemented an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.
• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.
