Chris Busby, global head of the semiconductor segment, says: “These new high-temperature FFKM and FKM are fluorinated surfactant-free, meaning they are manufactured without low molecular weight PFAS fluorinated surfactants to reduce environmental impact. Their introduction helps semiconductor customers future-proof their sealing solutions in the face of regulations seeking to reduce or eliminate PFAS, while also reducing the environmental impact of their products without compromising material performance and durability.”
Isolast® PureFab® JPF50 is a high-purity, filler-free FFKM that extends shelf life and increases performance, meeting the demanding requirements of the semiconductor industry. Isolast® PureFab® JPF58 is a high-temperature FFKM that delivers purity and performance in demanding semiconductor applications to extend shelf life. Isolast® PureFab® VPF20, a high-purity FKM, is designed for contamination-free production in semiconductor and flat panel display manufacturing, where purity is critical. The entire range of Trelleborg semiconductor solutions is designed to perform and prevent premature failure under the extreme temperatures and aggressive chemical precursors that increasingly characterize semiconductor environments.
“As a Trelleborg customer, you benefit from world-class engineering capabilities to develop the right customized solutions for the increasingly extreme environments of today’s factories and sub-factories, including the unique ability to model compression strain data using finite element analysis (FEA),” adds Busby. “Our advanced, game-changing FEA provides engineers with more accurate gasket life predictions as they design and manufacture finished products.”
Trelleborg will be showcasing its full Isolast® PureFab® range, which delivers high performance in aggressive front-end processes such as deposition, etching, ash/stripping, plasma cleaning, and thermal processing, including atomic layer deposition. One of the standout products in Trelleborg’s Isolast® PureFab® range is JPF44, a high-temperature FFKM with a Shore A hardness of 75, operating at temperatures up to 325°C/617°F. Designed for sealing at extreme temperatures in thermal and sub-fabric process environments, it has excellent chemical resistance to reactive gases such as NF₃, O₂, and CF₄. JPF44 exhibits superior resistance to compression set, even after extended thermal cycling, and is ideal for RTP, high-temperature CVD, diffusion furnace tooling, and vacuum pumps. It features low outgassing and relatively high purity, minimizing particle generation and contamination, and providing reliable, long-term sealing, thus reducing tool downtime and the frequency of preventative maintenance.
Also on display are bonded groove valve seals for wafer transfer chambers, offering significantly superior performance compared to conventional O-rings. Composed of dynamic rubber seals bonded to the metal, they are characterized by a longer service life and much more reliable sealing performance. Thanks to their extremely low particle generation and high durability, costly downtime and maintenance intervals are minimized. Naturally, this reliable product meets all semiconductor industry standards. Another solution on display is the Turcon® Variseal® NW. The Turcon® flange gasket housing includes an actuating spring that eliminates the possibility of contact between the spring or spring cavity and the system media. It is ideal for semiconductor applications, where it can operate successfully in a vacuum and has proven effective with fluorine gas.
Trelleborg will also soon introduce a new solution to complement the elastomer bands that traditionally protect the adhesive interface layer between the ceramic and aluminum layers of electrostatic mandrels (ESCs). ESCs are a specialized type of mandrel that uses electrostatic force to hold, retain, or pick up objects, and are typically used in etching and deposition chambers to secure thin, delicate silicon wafers. Manufactured from high-purity Isolast® PureFab® FFKM or Turcon® PTFE compounds, Trelleborg's ESC mandrel sealing solutions extend service life by protecting the ESC's outer diameter from plasma erosion. They are available in elastomer (FFKM) versions and in a PTFE design for low-temperature cryogenic etching applications.
