A specific number of GPIO pins are located on the edge of the module, while the remaining GPIO pins are on the bottom die. In total, the module provides access to all 32 GPIO pins of the chip. Despite its hybrid castellated hole and LGA packaging, the module remains about the size of a two-cent coin. This combines the advantages of both worlds without compromising size, resulting in one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate hand soldering and support the use of low-cost, two-layer PCB designs and optical inspection methods, eliminating the need for expensive X-ray machines.
The module also features an integrated ARM Cortex-M33 microcontroller with a generous 1.5MB of flash memory and 256KB of RAM.
Tomislav Tipura, Product Manager at Panasonic Industry, comments: “Our latest Bluetooth module, the PAN B511-1C, boasts highly complex and sophisticated algorithms. We also offer three different specification variants to enable a wide range of applications. For example, the modules are available with an additional integrated slow-clock crystal for energy-efficient battery operation and an additional 4MB of flash memory for more complex applications. We believe our customers will appreciate this module for its versatility and power at a competitive price.”
An 8 dBm output makes the module ideal for the European market. Key target applications include lighting, household appliances, industrial sensors, medical devices, wearable healthcare devices, energy management devices, and solar farms. Furthermore, the PAN B511-1C is ideal for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX service, which facilitates Matter production and production launches. The module will be available in three different specification variants to meet diverse project needs.
The PAN B511-1C Bluetooth module will be certified by CE RED, FCC, ISED, and MIC. Samples are already available, and mass production is scheduled to begin in June 2025.
