These pre-certified modules integrate WiFi® 6 and Bluetooth® Low Energy 5.4 technologies, offering a reliable and efficient solution for next-generation IoT applications in sectors such as commercial automation, medical equipment, smart appliances, energy infrastructure, and building and home automation.
The CC330xMOD family comprises two variants: the CC3300MOD, designed for WiFi 6 connectivity in the 2.4 GHz band, and the CC3301MOD, which also adds Bluetooth Low Energy 5.4 compatibility. Both devices maintain backward compatibility with WiFi 4 (802.11 b/g/n), facilitating their integration into existing infrastructures and ensuring a smooth transition to more efficient and secure wireless networks.
Based on Texas Instruments' 10th generation connectivity chipsets, the CC330xMOD modules are distinguished by their high integration flexibility. They incorporate configurable digital interfaces for connecting to host MPUs or MCUs, allowing the use of SDIO, SPI, or UART for shared communication between Wi-Fi and BLE. This architecture makes them an ideal solution for low-cost embedded applications running on Linux or RTOS with a TCP/IP stack.
In addition to simplifying hardware development thanks to their pre-existing regulatory certification, the modules offer significant technical advantages, such as WPA3 support, improved energy efficiency through WiFi 6 technologies like OFDMA and Target Wake Time (TWT), and transfer speeds of up to 50 Mbps. All of this is integrated into a compact LGA package measuring just 11 × 11 mm, optimized for space-constrained designs.
With this proposal, Texas Instruments reinforces its commitment to the IoT market and connected systems, providing engineers with a robust, scalable platform ready to accelerate the development of industrial and consumer wireless devices.
