Based on an Infineon AIROC SoC, the modules offer robust performance with built-in security, flexible software hosting, and multiple antenna options. Designed for high-reliability environments, they are compatible with LE Audio and Auracast, and enable rapid integration into next-generation wireless systems.
Technical Features:
Based on the Infineon Technologies AIROC™ CYW55310 SoC, designed for next-generation wireless connectivity applications.
Full compatibility with the Bluetooth Core 6.0 specification, including Bluetooth Classic (BR/EDR) and all the latest Bluetooth LE features.
Support for LE Audio, LC3 codec, isochronous channels, and Auracast™ Broadcast Audio technology, facilitating multipoint audio and wireless broadcasting applications.
Integrated 192 MHz Arm Cortex-M33 processor with 2 MB ROM and 768 KB SRAM for running local applications or advanced processing functions.
Advanced security features through TrustZone® and CryptoCell-312, especially relevant for critical medical and industrial applications.
Configurable transmit power up to +10 dBm, with support for Class 1 range and receive sensitivity down to -110.5 dBm.
Wide industrial operating range of -40°C to +85°C, suitable for demanding environments and high-availability applications.
Advanced audio interfaces with support for TDM, I²S, and PCM, enabling HFP, A2DP, LE Audio, and multichannel audio applications.
Various antenna options are available: integrated antenna, MHF4 connector for external antenna, or RF output via PCB trace.
Flexible integration architectures include operation with Linux or Android processors, microcontrollers with RTOS, or even hostless operation using Infineon ModusToolbox.
