IDTechEx divides the sector into two aspects: "fully additive" and "3D surface printing." Both have multiple application opportunities that will develop over the next decade.

Fully Additive Electronic Manufacturing:
If both the structural and electronic aspects of a component are printed, the manufacturing process can be considered "fully additive." This manufacturing approach offers great freedom, as there are no restrictions on the distribution of conductive traces within the printed structural dielectric. This allows for features such as helical antennas, integrated capacitors, and raised vias that are difficult or impossible to produce using conventional methods. Furthermore, surface-mount components (SMDs) can be incorporated within the structure if desired.

Among the applications of fully additive electronics manufacturing is circuit prototyping, since complex multilayer circuits can be produced in-house much faster than sending designs to an external prototyping company. Another promising application with a potentially huge market is the encapsulation of advanced electronics, in which bare dies are embedded within a printed structure containing fine electronic traces. One advantage of this approach over conventional electronic encapsulation is that silicon integrated circuits can be placed closer together, making the entire system more compact.

3D Surface Printing:
Additive manufacturing electronics can also include applying electronic functionality to existing 3D surfaces. For example, conductive traces could be printed onto an injection-molded plastic part using methods such as spray printing or material extrusion. Durability and robustness can be improved by printing a dielectric material on top. Furthermore, SMD components can be mounted onto the 3D surface using pick-and-place and conductive adhesives. This method holds great promise for adding electronic components to larger parts, where the printing time for the structural plastic would be prohibitive.

One of the main applications of this method is the replacement of wiring in consumer products, vehicles, and even aircraft. Currently, wiring installation is a laborious manual task, with the potential for errors and short circuits if the wires rub against each other. Printing the wiring directly onto a 3D plastic surface automates the process and increases durability, as the conductive traces are ultimately embedded within a dielectric material.

Incorporation of Microfluidics and Photonics:
As additive manufacturing of electronics becomes more established, an increasing range of functionalities is likely to be incorporated within the additively manufactured component. This could include microfluidics, with electrical sensors, piezoelectric actuators, and even other MEMS components embedded within a 3D printed item, predominantly made of plastic. Lab-on-a-chip for medical diagnostics and wearable sensors for sweat analysis are two promising applications.

Additive manufacturing electronics also support photonic structures, although this will generally require improvements in the printing resolutions of the dielectric and conductive elements. Examples of potential applications include photonic sensors, where the refractive index of an optical path is modified by temperature or gas absorption, and ultimately, optoelectronic components.

Roadmap for Adoption:
Taking into account the current state of development and additional requirements such as manufacturing performance and resolution, the following chart shows a roadmap for a range of additive manufacturing electronic applications. Circuit prototypes are already commercially available, while integrated devices with many different functionalities are probably the most difficult to develop.