A boost for innovation in IME
Increased performance capabilities and reduced size have been two of the driving forces behind innovation in IME. Until recently, the structural form factor of electronics had seen little change, with printed circuit boards (PCBs) long dominating. 3D electronics can now be seen in operation across a wide range of industries, from automotive and consumer goods to sensor housings and aerospace applications.
As a subset of 3D electronics, IME specifically involves the process of manufacturing circuits on a flat surface, eliminating the need for a PCB, with electrical components mounted directly onto the part. This process typically uses screen printing to print ink (such as conductive ink, dielectric materials, and adhesives) onto a substrate like polycarbonate, which is then molded into a three-dimensional shape through thermoforming followed by injection molding, ultimately requiring less material than previous structural electronic methods.
IME components, which use significantly less plastic, can be manufactured thinner and more aerodynamic, while also generating lower material costs because fewer individual components are needed. IDTechEx reports that the existence of the in-mold decoration (IMD) market means that IME capabilities could be quite feasibly integrated into these companies' manufacturing processes, with little need for IME to start from scratch.
The IME value chain: from materials to machines
At the beginning of the IME value chain are the material suppliers, where multiple options for substrates and functional and graphic inks can be selected to suit specific applications. Many conductive ink companies supply functional inks to IME manufacturers.
IME technology developers occupy a central position. With the significant task of physically creating and assembling IME circuits, IDTechEx reports that many of these developers come from a human-machine interface (HMI) background, as existing manufacturing equipment can be utilized in the process. Manufacturers then undertake high-volume production to meet end-user demand, where the electronics can be transformed into a final product. Consumer device manufacturers, automotive OEMs, or aircraft manufacturers occupy the final end of the IME value chain, enabling them to design the desired product around optimized circuitry.
Applications of EMI and a growing share of the automotive industry
Smoke and carbon monoxide detectors and smart locks are some of the common applications of IME to date, though IDTechEx reports that the automotive sector is likely to experience the largest increase in IME adoption by volume compared to some of these other sectors, specifically between 2027 and 2030. HMI surfaces in car interiors, including steering wheels, window switches, and center consoles, create an opportunity for IME adoption, making usage more seamless for drivers and passengers.
The IME parts used in the end-to-end process are reportedly also expected to reduce vehicle carbon dioxide emissions by approximately one-third due to weight reduction and the resulting lower fuel consumption. This will not only benefit the environment but also automotive companies, as they will continue to meet their emissions reduction targets.
