A prime example of this industry-focused approach is Frenetic's new tool for designing and simulating flat magnetic components. To address another challenge in the automotive sector, where thermal constraints and power density are increasingly stringent, Frenetic has introduced capabilities such as package simulation and liquid cooling plate modeling.
As power electronics systems move towards higher switching frequencies and more compact and integrated designs, planar magnetic components are becoming more common, although also significantly more complex to design due to parasitic effects, thermal constraints, and integration requirements.
Dr. Chema Molina, founder and CEO of Frenetic, explains: “The challenge was not only to enable the design and simulation of planar magnetics, but to do so while maintaining the level of accuracy that engineers expect. Frenetic Planar —our design and simulation tool—addresses this by combining the accuracy typically associated with Finite Element Method (FEM) approaches with the speed of its own analytical models. This allows engineers to quickly explore and validate designs with an average accuracy of approximately 94% in just a few minutes, enabling significantly faster iterations compared to traditional workflows. We introduced this feature to our customers at the end of last year, and it is already being used by around 80% of them.”
Frenetic Simulatoris used in multiple sectors, including automotive, aerospace, and data centers, each with very different constraints. Instead of creating generic functions, Frenetic is developing its platform by collaborating closely with these industries and understanding how magnetic design challenges differ across applications. The new encapsulation simulation capability allows automotive engineers to account for the thermal and electromagnetic impact of resin materials surrounding the transformer, which can significantly affect component behavior. And support for cooling plates and liquid cooling enables the modeling of metallic cooling structures integrated into the transformer and connected to liquid cooling systems—an increasingly common requirement in high-power automotive applications.
Dr. Molina continues: “These advancements address the real challenges faced by engineers designing high-performance magnetic components for next-generation power electronics systems. But our evolving capabilities aren’t developing in isolation; they stem from growing demand among Frenetic’s customers. Looking ahead, Frenetic will continue to develop its platform around the pillars already outlined: closer collaboration with industry, faster and more accurate design capabilities, and the integration of AI to support engineering decisions in the early stages. As further evidence of the adoption of our tools, many Chinese companies are already integrating them into their engineering workflows. To support this, we are bringing on local partners: we recently signed an agreement with Szdore Electronics, which will represent us in the Chinese and Asian markets.”
