The collaboration encompasses Synopsys' Ansys HFSS™ 3D electromagnetic field analysis tool and Ansys Icepak® thermal analysis tool, and represents an important step towards optimizing the simulation workflow for electronic circuit designers.

Murata is also the first company to offer passive component simulation models through Ansys IcePak*. As the demand for high-speed, high-capacity communications continues to grow, electronic circuit design has become increasingly complex.

Engineers must consider a wide range of physical phenomena, from electromagnetic interference (EMI) to heat generation by components, within a single design. Addressing these challenges early in the design process is critical; overlooking them can lead to costly redesigns, longer development times, and increased prototyping expenses. This has put increased pressure on electronic component suppliers to provide high-quality, ready-to-use simulation models that are compatible with the tools engineers already use.

Developing accurate models for electromagnetic and thermal analysis is inherently complex, as both electromagnetic behavior and temperature distribution vary considerably depending on design conditions. Murata's vertically integrated approach, encompassing raw material development and manufacturing through final product processing, allows the company to leverage a vast proprietary dataset, resulting in simulation models that faithfully reflect the actual performance of components.

The models are compatible with Ansys 2026 R1. Ansys HFSS supports electromagnetic field analysis and covers Murata RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak supports thermal analysis and covers Murata power inductors. Looking ahead, Murata will continue to deepen its collaboration with Synopsys and expand its model portfolio to support more advanced and efficient electronic design.

The following data is available for download from the Murata website:

Electromagnetic field analysis data for Ansys HFSS — RF inductors

Electromagnetic field analysis data for Ansys HFSS — MLCC

Thermal analysis data for Ansys Icepak — Power Inductors

Notes *Based on research by Murata as of June 15, 2026.