It is precisely the complex assembly of components that establishes rigorous requirements for the planning and execution of the manufacturing process. From printed circuit board tolerances and a stable print pattern aperture design to the choice of solder paste and a reliable soldering process, the right decisions must be made at the earliest stages.
The "Complex Board Project" was an excellent opportunity to study in detail the technological challenges in manufacturing complex printed circuit boards. The focus was on the variety of component versions. Using the SIPLACE demonstration board as an example, which contains components with edge lengths ranging from just 0.3 mm x 0.15 mm to sizes on the order of centimeters, critical points in working with a complex mix of parts could be analyzed. The current results are now compiled in a technology handbook prepared by ASM Assembly Systems, ASYS, Christian Koenen, Fraunhofer IZM, Heraeus, Rehm Thermal Systems, and TDK Europe. The experts discuss the factors along the SMT value chain that must be considered for a robust manufacturing process. The goal of the partner companies is to offer electronic product manufacturers practical technological solutions for processing the smallest components (e.g. 03015) alongside very large components (e.g. transformers) in the same way, thus achieving more efficient and almost fault-free manufacturing.
Those interested can obtain the technology brochure "Complex Plates - SMT Requirements" at the Productronica trade fair (10-13/11/2015) in Munich, at the Rehm Thermal Systems booth 335 in hall A4.
