Other Semiconductors
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- Category: Other Semiconductors
ROHM has developed N-channel power MOSFETs that feature low on-resistance and high SOA capability. They are designed for power supplies in high-performance enterprise and AI servers.
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Microchip Technology's PolarFire® FPGA SoCs (System on Chip) have received AEC-Q100 certification from the Automotive Electronics Council. AEC-Q standards are a guideline for integrated circuits that uses stress testing to measure the reliability of electronic components in vehicles.
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Renesas Electronics Corporation has introduced comprehensive solutions for managing lithium-ion batteries across a wide range of battery-powered consumer products, including electric bicycles, vacuum cleaners, robots, and drones. With pre-validated firmware provided, the R-BMS F (Battery Management System Ready with Fixed Firmware) will reduce the learning curve for developers.
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Toshiba Electronics Europe GmbH (“Toshiba”) has launched an N-channel power MOSFET to meet the growing market demand for higher efficiency in power supply circuits. The new TK024N60Z1 utilizes the proven DTMOSVI 600V series process with a super junction structure to achieve low on-state resistance and reduce conduction losses.
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Printed circuit boards (PCBs) are the backbone of modern electronics, providing mechanical support and electrical connections for electronic components. The materials used in PCBs play a crucial role in the performance, durability, and reliability of the final product. This article explores common PCB materials, highlighting innovations from ShengYi, a leading supplier of PCB laminates.
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IAR announces its compatibility with Tongxin Microelectronics Co., Ltd.'s (TMC) THA6 Gen2 series of automotive MCUs. This collaboration, achieved through the latest version of IAR Embedded Workbench for Arm v9.60.3, enables developers to meet the high-performance and functional safety demands of next-generation automotive electronics.
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The rise of connected applications in the automotive and industrial markets is driving demand for wired connectivity solutions with higher bandwidth, lower latency, and enhanced security. Secure communication network solutions are vital for transmitting and processing data as intended. Microchip Technology introduces the new ATA650x CAN FD System Basis Chips (SBC) family, which integrate a high-speed CAN FD transceiver and a 5V LDO (Low-Drop Voltage) regulator, and are supplied in compact 8-, 10-, and 14-pin packages to save space.
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DigiKey has announced the launch of STMicroelectronics' second-generation STM32MP25 microprocessors. STMicroelectronics' flagship STM32 product portfolio is a mainstay among DigiKey's customers, and this second-generation STM32MP25 expands its product range and depth to better serve developers in their designs.
The STM32MP25 MPUs are designed to support high-level edge computing use cases, such as machine vision, and drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
"DigiKey customers have benefited from our collaboration with STMicroelectronics, and we look forward to providing them with the latest technology solutions to overcome complex security challenges, meet IoT connectivity needs, and enable developers to innovate," said Sean Sorteberg, Director of Semiconductors, Multi-Market at DigiKey.
The industrial-grade STM32MP25 single or dual Arm® Cortex®-A35 core is an MPU platform for Industry 4.0 and advanced AI Edge capabilities. A dedicated neural processing unit delivers 1.35 TOPS, making it the microprocessor of choice for AI Edge acceleration and robust security. This groundbreaking product innovation evolves system architecture and expands the possibilities for more advanced applications, including advanced machine vision.
“The STM32MP25 microprocessors effectively address the need for greater intelligence and processing power in connected IoT devices,” said Loris Valenti, vice president of digital application microcontrollers and RF products in the Americas at STMicroelectronics. “The new STM32MP257F-DK Discovery Kit, which runs on OpenSTLinux software compatible with the STM32 ecosystem, allows developers to quickly get started on their projects.”
For more information on this new series, visit the STMicroelectronics page at DigiKey.com.
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Renesas Electronics Corporation has announced that it has introduced the industry's first complete memory interface chipset solutions for the second generation of DDR5 multi-capacity range dual in-line memory modules (MRDIMM).
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onsemi has introduced the Treo platform, an analog and mixed-signal platform built with Bipolar-CMOS-DMOS (BCD) process technology on an advanced 65nm node. This platform provides the foundation for a wide range of onsemi's power and sensing solutions, including high-performance, low-power sensing, high-efficiency power management, and purpose-built communication devices.
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Microchip Technology has introduced its PolarFire® FPGA Ethernet sensor bridge, which works with the NVIDIA Holoscan sensor processing platform, to enable the development of AI-based sensor processing systems.
PolarFire FPGAs support various protocols and this is the first solution that will be part of Microchip's platform compatible with sensors based on MIPI® CSI-2® and the MIPI D-PHY℠ physical layer.
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The global edge computing market is projected to grow by more than 30 percent over the next five years to power mission-critical applications in the aerospace, defense, military, industrial, and medical sectors. To meet this growing demand for reliable, embedded solutions in mixed-criticality systems,
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