By significantly reducing the cell pitch compared to the previous generation, Magnachip has achieved a substantial increase in current capacity. Furthermore, the improved Reverse Bias Safe Operating Area (RBSOA) ensures stable and reliable operation under demanding high-voltage and high-current conditions. The products are available in standard TO-247 and high-capacity TO-247 Plus packages, offering great design flexibility for a wide range of applications.
According to market research firm Omdia, the global market for solar inverters and energy storage systems (ESS) is expected to grow from approximately $1.4 billion in 2024 to $2.7 billion in 2029, representing a compound annual growth rate (CAGR) of 10.6%. With the acceleration of global carbon neutrality initiatives, energy efficiency and high power density have become key metrics in inverter design.
Magnachip already supplies IGBT products to leading national and international solar inverter manufacturers, and is recognized for the high quality of its products and its advanced technology. With this new launch, the company expands its portfolio to cover a wide range of capacities—from residential inverters to industrial systems up to 150 kW—allowing customers to select the most suitable products for their operating environment.
The new generation of IGBTs incorporates Advanced Field Stop Trench technology, with an improved design and optimized manufacturing processes compared to the previous generation. Specifically, the cell pitch has been reduced by approximately 40%, significantly increasing current capacity within the same chip area. Furthermore, the RBSOA, which defines the safe operating limits of the semiconductor, has been improved by more than 30%, ensuring high stability under high voltage and high current conditions. This makes the devices suitable for a wider range of power applications.
Magnachip plans to further expand its product portfolio in the first half of 2026 with the introduction of a high-current series up to 650 V and 150 A, as well as new 750 V products. In addition, the company plans to incorporate the TO-247-4Lead package, which includes a Kelvin pin to improve switching efficiency, further strengthening its IGBT offering. This will allow Magnachip to offer a wider range of design options for the solar and ESS markets, which are evolving towards higher capacities and efficiency.
“This new generation of IGBTs improves efficiency and reliability thanks to optimized process technologies,” said Hyuk Woo, CTO of Magnachip. “Building on our market-proven technology and production capabilities, we will continue to expand our portfolio of solutions to better meet the diverse needs of our customers.”.
