Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to suit the unique conditions of industrial applications, including telecommunications, networking, embedded computing systems, and many more.
The memory requirements for many industrial applications differ significantly from those of SSDs designed for climate-controlled data centers, including the need for extended temperature ranges and the ability to maintain high reliability and performance under harsh operating conditions. Designed with these needs in mind, KIOXIA's new devices withstand a wide temperature range (-40°C to +85°C).
The devices can convert a triple-level cell (TLC) Flash memory (3 bits per cell) into a single-level cell (1 bit per cell), which improves performance and reliability.
“KIOXIA is committed to offering multiple industrial-grade solutions and adapting applications with extended lifecycles. With the addition of the latest generation of 3D BiCS FLASH industrial-grade flash memory, we can now present a highly reliable and efficient embedded memory solution for environments requiring a wider temperature range and increased processor compatibility,” commented Axel Stoermann, Vice President of Memory Marketing & Engineering at KIOXIA Europe GmbH.
KIOXIA also offers low-density SLC Flash memory solutions with a wide temperature range (-40 °C to +85 °C), designed to suit industrial applications.
