Mads Fischer, Sales Director for Europe at SIMCom, comments: “Our new smart AI modules are aimed at emerging IoT imaging applications that require AI functionality for positioning or identification. They give design engineers a head start by including the AI core, MCU, and connectivity, such as Wi-Fi and Bluetooth, in a compact module that can run readily available software.”
The SIM8666 and SIM8668 series are SIMCom's smart LTE AI modules with a basic Android operating system. Available in a compact 43 x 44 x 3.2 mm package, the devices feature Rockchip's 64-bit quad-core RK3566 and RK3568 IoT chips, an ARM Mali-G52 GPU, an 8M HDR ISP, and 1T NPU computing utilities. The modules support short-range Wi-Fi and Bluetooth communication, H.264/H.265 4k@60fps decoding and H.264/H.265 1080p@60fps, JPEG encoding/decoding, and much more.
The SIM8666 and SIM8668 series modules feature numerous interfaces and can connect to cameras, displays, audio equipment, sensors, and other devices. These devices support multidimensional data collection and human-machine interaction. The interfaces, which include LVDS, MIPI-DSI, RGB, eDp, HDMI 2.0, EBC, CSI, UART, SPI, I2C, GPIO, PWM, USB, PCIe, and SATA, make these AI smart modules highly versatile. The integrated NPU supports mixed INT8/INT16 operations, facilitating the conversion of algorithm models based on a wide range of frameworks such as TensorFlow, MXNet, PyTorch, and Caffe. This makes the modules suitable for applications such as IoT gateways, smart retail displays, industrial control, smart hospitals, smart central control, and smart security.
Fischer concludes: "Our new intelligent AI modules enable customers to quickly develop and deploy high-performance computing, multimedia, and lightweight AI designs at low cost for applications we haven't seen before."
