Liabilities
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An invisible force is at work in electronics. Although it cannot be touched or seen, it has the power to disable or even destroy electronic equipment. Almost everyone encounters this force: the crackling sound you hear when listening to the car radio during a nearby storm, or the vacuum cleaner that blurs the television picture. These are examples of radio frequency interference, abbreviated as RFI, also known as electromagnetic interference (EMI).
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Pulsiv Limited , the innovative power electronics technology company based in Cambridge, UK, has announced the launch of the world's most efficient* 65W GaN-optimized USB-C reference design , developed to manage the complex challenges associated with the thermal behavior of chargers.
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Comparison of SMD component series and their specifications
The KYOCERA AVX brand emerged from the merger of two renowned manufacturers and is currently one of the world's largest suppliers in the passive component industry. Changes in the corporate structure indirectly influenced TME's product catalog, which expanded even further.
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Samtec's ultramicro connector solutions include Razor Beam™ LP ultramicro blade and beam fine-pitch connectors available in 0.40 mm and 0.50 mm pitches with stack heights as low as 2 mm. These connectors are ideal for small, high-speed applications, offering speeds up to 56 Gbps PAM4 (SS5/ST5). The connectors feature a slim body and are designed to save space on the X, Y, and Z axes.
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Toshiba Electronics Europe GmbH (“Toshiba”) has launched two new products in its range of electronic fuses (eFuse ICs). The TCKE903NL and TCKE905ANA are reusable, thus reducing maintenance costs and recovery time for equipment repairs, and support various functions for protecting power line circuits.
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Mouser now has TE Connectivity's BESS stacked hybrid connectors in stock. These connectors feature a hybrid design for secure, reliable, and flexible connections. They are engineered with an enhanced electrically conductive material that provides excellent thermal conductivity and high performance at low temperatures. By integrating multiple power and signal pins, the connectors offer reliable connectivity in systems with varying electrical requirements.
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Samsung Electro-Mechanics presents its new range of multi-layer ceramic capacitors or MLCC (multi-layer ceramic capacitors) MLCC X7R 1812 inch that offer a capacity of 2.2nF~470nF and what is most remarkable: a nominal voltage of up to 2000VDC.
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Amphenol Industrial Operations now offers its SurLok Plus series in various sizes and configurations. The 10.3 mm Generation 2.0 SurLok Plus in-line connector, the 5.7 mm and 8.0 mm Generation 2.5 SurLok Plus, and the 14.0 mm SurLok Plus with EMI can be used to meet the energy storage and high-voltage connection and transfer requirements of the energy storage and electric vehicle markets.
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HELUKABEL is a supplier of a wide range of cables, including high- and low-temperature resistant cabling. This assortment includes solutions tailored to applications in the most demanding industries, such as steel mills, cold storage facilities, chemical processing plants, etc.
Below, we present four product series from the HELUKABEL brand. Their common characteristic is a wide thermal tolerance.
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With the rise of electrification and digitalization in the automotive world, it's always important to emphasize ESD protection. ESD2CANx-Q1 ESD are AEC-Q101 rated solutions, classified to dissipate contact ESD surges as specified by ISO 10605 for automotive applications. They feature a 36V operating voltage and a typical low I/O capacitance of 2.8 pF per channel, with a pinout that accommodates two automotive Controller Area Network (CAN) bus lines (CANH and CANL).
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Signal Transformer is strengthening its portfolio of magnetic solutions. In the last three years, Signal has introduced more than 1,200 new products to the global market, including chokes, inductors, and customized or modified standard products.
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KIOXIA Europe GmbH has begun shipping samples[1] of 2 TB (terabit) Quad-Level-Cell (QLC) memory devices featuring eighth-generation BiCS FLASH™ 3D Flash memory technology.
With its latest BiCS FLASH™ technology, KIOXIA has achieved both vertical and lateral scaling of the memory array through proprietary processes and innovative architectures.
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