Embedded Systems
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- Category: Embedded Systems
The ARM platform integrates, for the first time, all the necessary components for MIPI camera support directly onto the board, enabling plug-and-play connectivity for camera technology from its embedded vision partner, Basler. Because the 3.5-inch-based platform is modular and based on the SMARC standard, OEMs can quickly and cost-effectively customize performance and deploy their system solutions using a comprehensive ecosystem of ready-to-use components.
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- Category: Embedded Systems
Congatec has announced that the new 3.5-inch SBC conga-JC370 with 8th generation Intel Core processors (codename Whiskey Lake) has received excellent design ratings in independent studies conducted by Elektor Magazine and also excellent positions in UserBenchmark speed tests.
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- Category: Embedded Systems
Advantech is pleased to announce the SMARC 2.0 ROM-5720 module, based on the NXP ARM Cortex-A53 i.MX8M processor, offering excellent graphics performance and low power consumption. The ROM-5720 module supports resolutions up to 4Kp60 via HDMI 2.0 and 4Kp60 H.265 decoding with HDR.
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At its Embedded World 2020 showcase, congatec will cover the entire spectrum of embedded edge computing, from high-end edge servers to headless systems for ultra-low-power edge logic. Highlights include the upcoming PICMG COM-HPC standard, which congatec is championing with Christian Eder as chair of the COM-HPC subcommittee, as well as congatec's extensive SMARC ecosystem for the NXP i.MX8 family, designed for seamless use of MIPI camera and AI technologies, among other things.
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Advantech introduces its first NXP i.MX8 product, the Qseven module based on the Arm Advantech ROM-7720, which runs on the high-performance NXP Arm® Cortex™-A72 i.MX8 processor. The ROM-7720 supports 4K resolution via HDMI 2.0 with H.265 and H.264 hardware acceleration engines for video decoding and an additional GPU for image processing. With OpenVX, it is ideal for artificial intelligence, computer vision, and big data processing and analytics applications in the IoT era.
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Advantech presents the MIO-2361, the latest single-board Pico-ITX computer designed with LPDDR4-2400 and 32G eMMC onboard for Intel® Atom™ E3900 series / Pentium® N4200 / Celeron® N3350 processors. The robust design of the MIO-2361 means that typical memory assemblies (socket type) are not used.
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Mouser Electronics, Inc. distributes the MOD_CH101 ultrasonic time-of-flight (ToF) sensor module and the DK-CH101 SmartSonic™ platform from InvenSense, a TDK Group company. The ToF solutions offer fast and accurate range measurement with ultra-low power consumption and are capable of detecting objects of any size, color, and transparency.
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Anasonic Industry launches the successor to the PAN1740 Bluetooth module. The new PAN1740A is an optimized version, offering faster boot time and supporting up to eight connections for greater flexibility in creating more advanced applications.
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Renesas Electronics Corporation has introduced the RL78/G14 rapid prototyping board, a low-cost, feature-rich board designed to enable rapid product development for edge IoT devices. Renesas also introduced the RL78/G1D BLE module expansion board, which users can combine with the new prototyping board to add Bluetooth® Low Energy wireless communication capabilities.
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Congatec has introduced a new SMARC 2.0 COM (Computer on Module) module with an NXP Freescale i.MX 8M Nano processor based on the Arm Cortex-A53. The conga-SMX8-Nano defines a new low-end performance class for SMARC.
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Congatec and Japanese AI experts Hacarus have unveiled the world's first embedded AI kit utilizing Sparse Modeling technology. Sparse Modeling requires minimal training data to produce highly accurate predictions. This is advantageous for vision-based inspection systems, among others, because rejection rates are naturally lower when manufacturing quality is high. With Sparse Modeling, it's possible to create a new inspection model starting with 50 or even fewer images.
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Advantech introduces its latest fanless embedded system, the EPC-U2117. The EPC-U2117 system utilizes Intel® Atom® E3900 processor technology to improve CPU performance by 30% and increase graphics performance by 45%.
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