Embedded Systems

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Category: Embedded Systems

March 11, 2021

Congatec offers extended temperature range platforms for all performance levels, from high-end COM-HPC modules to low-power SMARC modules. The portfolio of solutions for COM-HPC server modules addresses the challenge of managing higher TDPs for these edge computing platforms across the extended temperature range.

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Category: Embedded Systems

March 8, 2021

Mouser introduces the Laird Connectivity BL653µ Nordic nRF52833 modules, designed for space-constrained applications to implement longer-range BLE in harsh environments. The BL653µ modules are low-power microcontrollers with multiple wireless capabilities, ideal for Internet of Things (IoT) wireless connectivity.

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Category: Embedded Systems

March 4, 2021

A user-friendly, full-featured development kit designed for development with AWS IoT Core cloud services. Includes:

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Category: Embedded Systems

March 4, 2021

As the next step in its ongoing mission to deliver secure and cyber-resilient system control solutions, Lattice Semiconductor Corporation has announced the latest version of its secure system control solution stack, Lattice Sentry™ 2.0.

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Category: Embedded Systems

March 4, 2021

Lattice Semiconductor Corporation has introduced the latest version of its award-winning solution stack for low-power embedded vision systems, Lattice mVision™ 2.0. The new version features multiple updates that further accelerate the design of embedded vision applications for industrial, automotive, medical, and smart consumer systems.

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Category: Embedded Systems

March 3, 2021

Congatec presents its new low-power SMARC 2.1 modules with the NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision, and artificial intelligence (AI). The new ultra-low-power conga-SMX8-Plus module enables embedded industrial systems to see and analyze their environment for situational awareness, visual inspection, identification, monitoring and tracking, as well as touchless machine operation based on gestures and augmented reality.

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Category: Embedded Systems

March 3, 2021

congatec introduces a new COM-HPC™ starter kit for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultrafast 2x25 GbE connectivity, as well as integrated MIPI-CSI vision capabilities.

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Category: Embedded Systems

March 3, 2021

Congatec has introduced extended temperature range platforms for all performance levels, from high-end COM-HPC modules to low-power SMARC modules. The portfolio of solutions for COM-HPC server modules addresses the challenge of managing higher TDPs for these edge computing platforms across the extended temperature range.

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Category: Embedded Systems

February 25, 2021

Silicon Labs introduces the new Si823Hx gate driver board, a comprehensive isolation solution well-suited for Wolfspeed's recently announced WolfPACK™ power module.

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Category: Embedded Systems

February 23, 2021

Advantech has announced the AIMB-218, an industrial-grade, fanless, low-profile Mini-ITX motherboard that incorporates Intel Atom® x6000E, Intel® Pentium®, and Celeron® N and J series processors.

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Category: Embedded Systems

February 22, 2021

Laird Connectivity's Sterling-LWB5+ Wi-Fi and Bluetooth modules are designed for the next generation of wireless IoT. The Sterling-LWB5+ is easy to integrate, with an ultra-small footprint, a simplified bill of materials, and reliable connectivity. The LWB5+ Wi-Fi module supports the latest WPA3 security standards.

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Category: Embedded Systems

February 10, 2021

Today, wireless interfaces are widespread and provide essential connectivity in everything from consumer devices to industrial IoT systems. In this article, we'll explore the features of four well-known wireless standards (Wi-Fi, Bluetooth Mesh, Z-Wave, and cellular) and review some of the available development platforms.