Embedded Systems
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Arrow Electronics has announced the release of a new evaluation platform, designed in collaboration with Microchip Technology, Bourns, and Amphenol: the 10BASE-T1S REF_SPE_T1S reference design board. This reference design helps engineers adopt Single Pair Ethernet (SPE) by addressing the magnetic connection that links data to the physical cable and enables system-level evaluation of signal integrity, EMC behavior, and noise immunity in real-world applications.
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Würth Elektronik and embedded systems developer Grinn present the Grinn GenioBoard SBC – Edge AI. The board for Edge AI in IoT is now available through Würth Elektronik. With this offering, Würth Elektronik positions itself as an expert partner in product development for Edge AI. The offering includes suitable products, design tools, and consulting in areas such as electromagnetic compatibility (EMC), thermal management, sensors, wireless communication, power supply, and cybersecurity.
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Direct Insight, a British technical systems integrator specializing in system-on-module (SoM) solutions, can now offer and support the development of cost-optimized embedded system applications requiring integrated wireless connectivity, thanks to the QSMP-15W, a solderable QFN-type SoM incorporating an industrial-grade STM32MP1 MPU and a Murata Wi-Fi + Bluetooth module.
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The increasing complexity of embedded systems, driven by trends such as software-defined vehicles, edge intelligence, and AI infrastructure, has highlighted the limitations of traditional development workflows. In this context, Renesas presents Renesas 365, an open and intelligent platform that redefines electronic design through a model-driven approach and a continuous digital thread.
This article analyzes the architecture, capabilities, and technical contributions of this platform, as well as its impact on the entire embedded development lifecycle.
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Red Pitaya has announced a significant expansion of its multi-channel sync and high-speed streaming capabilities on its STEMlab 125-14 Gen 2 platform. Following the introduction of the STEMlab PRO Gen 2 series at Embedded World last year, this year's presentation focuses on system-level performance. Engineers can now combine multiple STEMlab boards into highly synchronized and configurable configurations, significantly expanding input and output capacity while maintaining precise clock and trigger alignment across the entire system.
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ADLINK Technology Inc. has launched the ADLINK MXM family of integrated graphics modules and AI accelerators based on the NVIDIA Blackwell architecture. Offered in industry-standard MXM 3.1 Type A/B form factors, the new modules deliver scalable performance and energy efficiency for next-generation applications in AI, robotics, and edge computing.
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Sfera Labs has launched the M.2 LTE Module X2 Series (X2BW10XM2Z) expansion board, a new interchangeable board that adds LTE cellular connectivity and GNSS positioning to the Strato Pi Max XL and XS servers. The Strato Pi Max is a compact and versatile industrial controller based on the Raspberry Pi Compute Module 4 or 5.
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MIPS, a GlobalFoundries company, and Green Hills Software, a security and protection company for embedded systems, announced their collaboration to offer a jointly developed Safety SDK. This new solution will accelerate functional safety certification and time to market for next-generation automotive and industrial systems geared toward ASIL-D/SIL 3/4 compliance.
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Congatec has introduced a new series of COM Express 3.1 Type 6 Compact modules. The new conga-TCRP1 modules are based on the latest AMD Ryzen™ AI Embedded P100 Series processors with 4 or 6 cores and support industrial temperature ranges from -40 to +85 °C
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DATA MODUL expands its embedded systems portfolio with a powerful single-board computer (SBC) from its partner FORLINX Embedded. The new OK3588 SBC is based on the Rockchip RK3588 AIoT processor and allows simultaneous control of four independent displays with different video content
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The Eclipse Foundation will present a broad portfolio of technologies encompassing industrial IoT, automotive software, edge artificial intelligence, real-time operating systems, and regulatory alignment for software development.
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Kontron announces the serial production availability of its new 5G M.2 broadband module, the IB17M-W. Developed in Berlin and manufactured in Düsseldorf, the module combines high performance with global 5G connectivity and is particularly well-suited for industrial applications, rail transport, and avionics.
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