Users can quickly identify power and signal integrity issues with greater flexibility and easier access to a comprehensive set of analysis functions that can be leveraged throughout the entire board design workflow.
Powered by its hybrid full-wave finite element EM calculation engine, the new SIwave suite offers a complete solution for signal integrity analysis in a single user interface. SIwave-DC performs DC analysis on high- and low-voltage PCBs and IC packages, and allows for end-to-end critical voltage margin estimation for reliable power delivery. SIwave-PI includes all the features of SIwave-DC and adds AC analysis for accurately modeling power distribution networks and noise propagation on a printed circuit board. SIwave combines all the functionality of SIwave-DC and SIwave-PI and adds a powerful time-domain circuit simulation engine for comprehensive end-to-end signal integrity design and compliance.
Key features of ANSYS SIwave include:
The new application-specific product offering
, SIwave-DC, allows users to perform pre- and post-design analysis of DC sag, current density, and DC power density. This ensures that power distribution networks (PDNs) can deliver adequate power to integrated circuits by verifying that the PDN has the correct bump, ball, and pin sizes, as well as the appropriate copper weighting to minimize losses and identify areas of excess current that cause hot spots, thus reducing the risk of electric field failures.
Using sophisticated algorithms, SIwave-PI allows users to specify various limits (capacitor price, total number of capacitors, impedance of the chosen network, etc.) that must be considered based on cost. During simulation, precise frequency-dependent S-parameter capacitor models are used. Additionally, the full-wave electromagnetic pull motor captures the impact of the capacitor's physical location and mounting technique. SIwave-PI substantially improves productivity by automating decoupled capacitor selection, placement, and optimization of printed circuit boards and IC packages.
With SIwave, signal integrity engineers can easily import electrical geometry from CAD, extract precise GHz and interconnect models for the IC package and PCB, include transistor-level models of drivers and receivers, and perform signal cutoff analysis, impedance matching, and power supply system optimization. This solution includes common IBIS (Input/Output Buffer Information Specification) analyses, such as Power-Aware IBIS and IBIS-AMI, enabling design engineers to perform virtual validation.
Among other features, SIwave includes key functions such as virtual compliance, performance acceleration for advanced simulations and HPC (High-Performance Computing) simulations, and bidirectional connectivity with ANSYS® Icepak® and ANSYS® Mechanical™ to predict temperature rise, thermally induced stress, and structural integrity.
